Micro System Packaging Laboratory (MSPL)
Journals
2020
01/
Effects of Silane Coupling Agents on the Adhesion Strength of a Printed Cu Circuit on Polyimide
Lee, C. J., Park, B. G., Jung, K. H., Kim, Y., Jung, S. B.
Science of Advanced Materials Vol. 12 p.594 (2020)
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00022
02/
Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes
Jeong, H., Lee, C. J., Myung, W. R., Min, K. D., Jung, S. B.
Science of Advanced Materials, Vol. 12, p.564 (2020)
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00017
03/
Mechanical Properties and Microstructure of Cu Core Solder Ball (CCSB) Compared with SAC305 Solder for 2.5D and 3D Structure Package (PKG)
Son, J. Y., Jeong, H., Lee, S., Lee, Y., Jung, S. B.
Science of Advanced Materials, Vol. 12, p.556 (2020)
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00016
04/
Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint
Lee, C. J., Kim, J. H., Jeong, H., Bang, J. O., Jung, S. B.
Science of Advanced Materials, Vol. 12, p.538 (2020)
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00013
05/
Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish
Jeong, H., Myung, W. R., Kim, K. Y., Min, K. D., Jung, S. B.
Science of Advanced Materials, Vol. 12, p.525 (2020)
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00011
06/
Microstructures and Mechanical Properties of AA6061-T4 Composites Containing SiC and B4C Particles Fabricated by Friction Stir Processing
Park, H. J., Ahn, B. W., Kim, J. H., Lee, J. G., Jung, S. B.
Science of Advanced Materials, Vol. 12, p.531 (2020)
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00012
2019
01/
Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method
Lee, C. J., Jung, K. H., Park, B. G., Kim, Y., Jung, S. B.
Jounal of Materials Science: Materials in Electronics Vol. 30 p.4079 (2019)
https://link.springer.com/article/10.1007/s10854-019-00696-4
02/
Electromigration behaviors of Sn58% Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB
Kim, J., Jung, K. H., Kim, J. H., Lee, C. J., Jung, S. B.
Journal of Alloys and Compounds Vol. 775 p.581 (2019)
https://www.sciencedirect.com/science/article/pii/S0925838818336946
03/
Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles
Park, H. J., Lee, C. J., Min, K. D., Jung, S. B.
Journal of Electronic Materials Vol. 48 p.1746 (2019)
https://link.springer.com/article/10.1007/s11664-018-06882-0
04/
Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant
Jung, K. H., Min, K. D., Lee, C. J., Jung, S. B.
Journal of Alloys and Compounds Vol. 781 p.657 (2019)
https://www.sciencedirect.com/science/article/pii/S0925838818345791
05/
Effect of Different Surface Finishes on Bending Reliability of the Rigid Printed Circuit Board and Flexible Printed Circuit Board Substrate Joints with the Transverse Ultrasonic Bonding Process
Lee, J. G., Lee, J. B., Kim, S. W., Joo, J. H., Jung, S. B.
Nanoscience and Nanotechnology Letters Vol. 11 p.839 (2019)
https://www.ingentaconnect.com/contentone/asp/nnl/2019/00000011/00000006/art00012
06/
Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging
Kim, J., Back, J. H., Jung, S. B., Yoon, J. W.
Journal of Materials Science: Materials in Electronics Vol. 30 p.12911 (2019)
https://link.springer.com/article/10.1007/s10854-019-01653-x
07/
Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics
Lee, C. J., Park, B. G., Jeong, H., Jung, K. H., Jung, S. B.
Journal of Alloys and Compounds Vol. 794 p.341 (2019)
https://www.sciencedirect.com/science/article/abs/pii/S0925838819315981
08/
Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder
Lee, C. J., Jeong, H., Jung, K. H., Min, K. D., Jung, S. B.
Journal of Materials Science: Materials in Electronics Vol. 30 p.12869 (2019)
https://link.springer.com/article/10.1007/s10854-019-01648-8
10/
A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency
Kim, S. W., Ju, Y. H., Han, S., Kim, J. S., Lee, H. J., Han, C. J., Lee, C. R., Jung, S. B., Kim, Y., Kim, J. W.
Journal of Materials Chemistry A Vol. 7 p.22588 (2019)
https://pubs.rsc.org/ko/content/articlelanding/2019/ta/c9ta04634h/unauth#!divAbstract
09/
Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints
Lee, C. J., Bang, J. O., Jung, S. B.
Microelectronic Engineering Vol. 216 p.111055 (2019)
https://www.sciencedirect.com/science/article/abs/pii/S0167931719302126
11/
Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder
Lee, C. J., Min, K. D., Park, H. J., Kim, J. H., Jung, S. B.
Electronic Materials Letters Vol. 15 p.693 (2019)
https://link.springer.com/article/10.1007/s13391-019-00176-1
12/
Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high‑temperature packaging applications
Min, K. D., Jung, K. H., Lee, C. J., Jeong, H., Jung, S. B.
Journal of Materials Science: Materials in Electronics Vol. 30 p.18848 (2019)
https://link.springer.com/article/10.1007/s10854-019-02241-9
13/
Optimal Ni(P) thickness and reliability evaluation of thin-Au Pd(P) Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
Kim, J., Jung, S. B., Yoon, J. W.
Journal of Alloys and Compounds Vol. 805 p.1013 (2019)
https://www.sciencedirect.com/science/article/abs/pii/S0925838819326933
14/
Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages
Jung, K. H., Min, K. D., Lee, C. J., Park, B. G., Jeong, H., Koo, J. M., Lee, B. H., Jung, S. B.
Applied Surface Science Vol. 495 p.143487 (2019)
https://www.sciencedirect.com/science/article/pii/S0169433219322652
15/
The effect of pH on synthesizing Ni-decorated MWCNTs and its applicationfor Sn-58Bi solder
Lee, C. J., Min, K. D., Hwang, B. U., Kim, J. H., Jung, S. B.
Current Applied Physics Vol. 19 p.1182 (2019)
https://www.sciencedirect.com/science/article/pii/S156717391930197X
2018
01/
Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure
Shin, H. W., Jung, S. B., Lee, H. S.
Journal of Electronic Materials Vol. 47 p.7273 (2018)
https://link.springer.com/article/10.1007/s11664-018-6672-0
02/
1.4 µm-Thick Transparent Radio Frequency Transmission Lines Based on Instant Fusion of Polyethylene Terephthalate Through Surface of Ag Nanowires
Kim, S. W., Kim, K. S., Park, M., Nah, W., Kim, D. U., Lee, C. R., Jung, S. B., Kim, J. W.
Electronic Materials Letters Vol. 14 p.599 (2018)
https://link.springer.com/article/10.1007/s13391-018-0069-3
03/
Enhancing adhesion strength of photonic sintered screen-printed Ag circuit by atmospheric pressure plasma
Park,. B. G., Lee, C. J., Jung, S. B.
Microelectronic Engineering Vol.202 p.37 (2018)
https://www.sciencedirect.com/science/article/pii/S0167931718304726
04/
Effect of surface finish metallization on mechanical strength of Ag sintered joint
Yoon, J. W., Back, J. H., & Jung, S. B. (2018).
Microelectronic Engineering Vol.198 p.15 (2018)
https://www.sciencedirect.com/science/article/pii/S0167931718302430
05/
Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85° C/85% Relative Humidity Environmental Conditions
Kim, K. Y., Myung, W. R., Jeong, H., Sung, Y. G., Jung, S. B.
Journal of Nanoscience and Nanotechnology Vol.18 p.6162 (2018)
https://www.ingentaconnect.com/contentone/asp/jnn/2018/00000018/00000009/art00056
06/
Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test
Jeong, H., Myung, W. R., Sung, Y. G., Kim, K. Y., Jung, S. B.
Journal of Nanoscience and Nanotechnology Vol.18 p.6316 (2018)
https://www.ingentaconnect.com/contentone/asp/jnn/2018/00000018/00000009/art00084
07/
Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy
Jung, K. H., Kim, J., Park, B. G., Lee, C. J., Sung, H. J., Jung, S. B.
Journal of Alloys and Compounds Vol.748 p.898 (2018)
https://www.sciencedirect.com/science/article/pii/S0925838818310399
08/
Transparent and flexible high frequency transmission lines based on composite structure comprising silver nanowires and polyvinyl butyral
Kim, S. W., Kim, K., Nah, W., Lee, C. R., Jung, S. B., Kim, J. W.
Composites Science and Technology Vol.159 p.25 (2018)
https://www.sciencedirect.com/science/article/pii/S0266353817326155
09/
Mechanical Reliability of the Epoxy Sn-58wt.% Bi Solder Joints with Different Surface Finishes Under Thermal Shock
Sung, Y. G., Myung, W. R., Jeong, H., Ko, M. K., Moon, J., Jung, S. B.
Journal of Electronic Materials Vol.47 p.4165 (2018)
https://link.springer.com/article/10.1007/s11664-018-6224-7
10/
Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints
Yoon, J. W., Back, J. H., Jung, S. B.
Journal of Materials Science: Materials in Electronics Vol.29 p.4724 (2018)
https://link.springer.com/article/10.1007/s10854-017-8426-9
11/
RF characteristics of flexible circuits patterned with hybrid Ag paste
Jung, K. H., Kim, S. W., Maeng, M. K., Kam, D. G., Jung, S. B.
Journal of Materials Science: Materials in Electronics Vol.29 p.5074 (2018)
https://link.springer.com/article/10.1007/s10854-017-8470-5
12/
Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes
Yoon, J. W., Back, J. H., Jung, S. B.
Surface and Interface Analysis (2018)
https://onlinelibrary.wiley.com/doi/abs/10.1002/sia.6419
2017
01/
Effect of Sodium Dodecylbenzene Sulfonate Contents on Oxide Behavior in Cu Nanopaste
Lee, C. J., Kim, K. Y., Jung, K. H., Jung, S. B.
Journal of Nanoscience and Nanotechnology Vol.17 p.7497 (2017)
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000010/art00080
02/
Photo-induced fabrication of Ag nanowire circuitry for invisible, ultrathin, conformable pressure sensors
Han, C. J., Park, B. G., Oh, M. S., Jung, S. B., Kim, J. W.
Journal of Materials Chemistry C Vol.5 p9986 (2017)
http://pubs.rsc.org/en/content/articlehtml/2017/tc/c7tc01423f
03/
Enhancement of Cu pillar bumps by electroless Ni plating
Lee, B. S., Jung, S. B., Yoon, J. W.
Microelectronic Engineering Vol.180 p52 (2017)
https://www.sciencedirect.com/science/article/pii/S0167931717302770
04/
Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy
Myung, W. R., Sung, Y. G., Moon, J., & Jung, S. B. (2017).
Nanoscience and Nanotechnology Letters Vol.9 p1190
https://www.ingentaconnect.com/contentone/asp/nnl/2017/00000009/00000008/art00009
05/
Evaluation of the Long-Term Reliability of the Epoxy-Contained SAC305 Solder with Organic Solderability Preservative Surface Finish
Sung, Y. G., Myung, W. R., Jung, H., Kim, K. Y., Jung, S. B.
Nanoscience and Nanotechnology Letters Vol.9 p1202 (2017)
https://www.ingentaconnect.com/content/asp/nnl/2017/00000009/00000008/art00011
06/
The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking
Myung, W. R., Kim, K. Y., Kim, Y., Jung, S. B
Journal of Materials Science: Materials in Electronics Vol.28 p16467 (2017)
https://link.springer.com/article/10.1007/s10854-017-7558-2
07/
Bondability and Reliability of Multi-Chip Packages Bonded with Non-Conductive Paste Using Thermal Compression Energy and Ultrasonic Energy
Lee, J. G., Lee, J. B., Myung, W. R., Yoon, J. W., Jung, S. B.
Journal of Nanoscience and Nanotechnology Vol.17 p2937 (2017)
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000005/art00011
08/
Fabrication of Sn–58Bi–xCe Solder Paste Using Electrical Wire Explosion Method and its Mechanical Property
Bang, J. O., Lee, H. S., Jung, S. B.
Journal of Nanoscience and Nanotechnology Vol.17 p3033 (2017)
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000005/art00025
09/
Thermo-Mechanical Behavior of Die Attach Film on Flexible PCB Substrate for Multi-Chip Package
Bang, J. O., Jung, K. H., Lee, Y. M., Jung, S. B.
Thermo-Mechanical Behavior of Die Attach Film on Flexible PCB Substrate for Multi-Chip Package
Journal of Nanoscience and Nanotechnology Vol.17 p3130 (2017)
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000005/art00043
10/
Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility
Park, B. G., Jung, K. H., Jung, S. B.
Journal of Alloys and Compounds Vol.699 p1186 (2017)
https://www.sciencedirect.com/science/article/pii/S0925838816342244
11/
Microstructure and mechanical properties of a B4C particle-reinforced Cu matrix composite fabricated by friction stir welding
Ahn, B. W., Kim, J. H., Hamad, K., Jung, S. B.
Journal of Alloys and Compounds Vol.693 p688 (2017)
https://www.sciencedirect.com/science/article/pii/S0925838816327062
12/
Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods
Lim, J. H., Lee, S. M., Kim, H. S., Kim, H. Y., Park, J., Jung, S. B., Park, G. C., Kim, J., Joo, J.
Scientific Reports Vol.7 p41992 (2017)
https://www.nature.com/articles/srep41992
13/
Analysis of peel strength of consisting of an aluminum sheet, anodic aluminum oxide and a copper foil laminate composite
Shin, H. W., Lee, H. S., Jung, S. B.
Metals and Materials International Vol.23 p207 (2017)
https://link.springer.com/article/10.1007/s12540-017-6493-3
2016
01/
High-Temperature Oxidation of Ti–44Al–6Nb–2Cr–0.3 Si–0.1 C Alloy
Park, S. Y., Seo, D. Y., Kim, S. W., Kim, S. E., Hong, J. K., Jung, S. B., Bak, S. H., Lee, D. B.
Science of Advanced Materials Vol.8 p2264 (2016)
https://www.ingentaconnect.com/contentone/asp/sam/2016/00000008/00000012/art00013
02/
Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB
Kim, J., Myung, W. R., Jung, S. B.
Journal of Electronic Materials Vol.45 p5895 (2016)
https://link.springer.com/article/10.1007/s11664-016-4803-z
03/
Effect of Al incorporation on morphology and electrical conductivity of ZnO nanorods prepared using hydrothermal method
Jeong, S. H., Park, G. C., Choi, J. H., Lee, C. M., Lee, S. M., Seo, T. Y., Choi, D. H., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology Vol.16 p11272 (2016)
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00028
04/
Effects of Hydrothermal Temperature on Crystallinity, Microstructure, and Photocatalytic Activity of Anatase TiO2 Mesocrystals
Seo, T. Y., Lee, S. M., Choi, J. H., Lee, C. M., Park, G. C., Jeong, S. H., Jung, S. B., Lim, J. H., Joo, J.
Effects of Hydrothermal Temperature on Crystallinity, Microstructure, and Photocatalytic Activity of Anatase TiO2 Mesocrystals
Journal of Nanoscience and Nanotechnology Vol.16 p11153 (2016)
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00006
05/
Effects of Precursor Concentration on Morphology of MoS2 Nanosheets by Hydrothermal Synthesis
Lee, C. M., Park, G. C., Lee, S. M., Choi, J. H., Jeong, S. H., Seo, T. Y., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology Vol.16 p11548 (2016)
https://www.ingentaconnect.com/contentone/asp/jnn/2016/00000016/00000011/art00085
06/
Enhanced photocatalytic activity of ZnO nanorods with tubular facet synthesized by hydrothermal method
Park, G. C., Lee, S. M., Jeong, S. H., Choi, J. H., Lee, C. M., Seo, T. Y., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology Vol.16 p11164 (2016)
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00008
07/
Morphology Control in Anatase TiO2 Mesocrystals Through Hydrofluoride Incorporation for Photocatalytic Application
Lee, S. M., Seo, T. Y., Park, G. C., Choi, J. H., Jeong, S. H., Jung, S. B., Choi, D. H., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology Vol.16 p10592 (2016)
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000010/art00080
08/
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications
Kim, D. U., Kim, K. S., Jung, S. B.
Microelectronics Reliability Vol.63 p120 (2016)
https://www.sciencedirect.com/science/article/pii/S0026271416301135
09/
Facet-controlled anatase TiO2 nanoparticles through various fluorine sources for superior photocatalytic activity
Lee, S. M., Park, G. C., Seo, T. Y., Jung, S. B., Lee, J. H., Kim, Y. D., Choi, D. H., Lim, J. H., Joo, J.
Nanotechnology Vol.27 p395604 (2016)
http://iopscience.iop.org/article/10.1088/0957-4484/27/39/395604/meta
10/
Adhesion of PDMS substrates assisted by Plasma Graft Polymerization
Jung, K. H., Kim, D. G., & Jung, S. B.
Surface and Interface Analysis Vol.48 p597 (2016)
https://onlinelibrary.wiley.com/doi/abs/10.1002/sia.5985
11/
Fabrication of Cu–MWNT nanocomposite and its electrochemical migration behaviors
Kim, K. S., Jung, S. B., Kim, D. U.
Journal of Materials Science: Materials in Electronics Vol.27 p9676 (2016)
https://link.springer.com/article/10.1007/s10854-016-5028-x
12/
Application of the Taguchi Method to Optimize Graphene Coatings on Copper Nanoparticles Formed Using a Solid Carbon Source
Choi, D., Pyo, Y., Jung, S. B., Kim, Y., Yoon, E. H., Lee, C. S.
MATERIALS TRANSACTIONS Vol.57 p1177 (2016)
https://www.jstage.jst.go.jp/article/matertrans/57/7/57_M2016011/_article/-char/ja/
13/
Fabrication of high quality carbonaceous coating on Cu nanoparticle using poly (vinyl pyrrolidone) and its application for oxidation prevention
Pyo, Y., Choi, D., Son, Y. H., Kang, S., Yoon, E. H., Jung, S. B., Kim, Y., Lee, C. S.
Japanese Journal of Applied Physics Vol.55 p055001 (2016)
http://iopscience.iop.org/article/10.7567/JJAP.55.055001/meta
14/
Drop Reliability of Epoxy-contained Sn-58 wt.% Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Myung, W. R., Kim, Y., Kim, K. Y., Jung, S. B.
Journal of Electronic Materials Vol.45 p3651 (2016)
https://link.springer.com/article/10.1007/s11664-016-4517-2
15/
Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints
Yoon, J. W., Jung, S. B.
MATERIALS TRANSACTIONS Vol.57 p716 (2016)
https://www.jstage.jst.go.jp/article/matertrans/57/5/57_M2016006/_article/-char/ja/
16/
Electromigration effect on Sn-58% Bi solder joints with various substrate metallizations under current stress
Lee, S. M., Yoon, J. W., Jung, S. B. (2016).
Journal of Materials Science: Materials in Electronics Vol.27 p1105 (2016)
https://link.springer.com/article/10.1007/s10854-015-3858-6
17/
Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes
Lee, S. M., Yoon, J. W., Jung, S. B.
MATERIALS TRANSACTIONS Vol.57 p466 (2016)
https://www.jstage.jst.go.jp/article/matertrans/57/3/57_M2015260/_article/-char/ja/
18/
Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor
Kim, D. G., Kim, J., Jung, S. B., Kim, Y. S., Kim, J. W. (2016).
Applied Surface Science Vol.380 p223 (2016)
https://www.sciencedirect.com/science/article/pii/S0169433216001677
19/
Microstructures and mechanical properties of MgOp/SPHC metal matrix composites joint by friction stir welding
Ahn, B. W., Kim, J. H., Choi, D. H., Jung, S. B.
Journal of Composite Materials Vol.50 p1581 (2016)
http://journals.sagepub.com/doi/abs/10.1177/0021998315579231
2015
01/
Wire Sweep Characterization in System-in-Package (SiP) Component with Au Wire Bonding During Epoxy Molding Compounds Molding Process
Woo-Ram Myung, Jae-Oh Bang, Sang-Su Ha, Dae Up Kim, Seung-Boo Jung
Nanoscience and Nanotechnology Letters Vol.7 p.994 (2015)
http://www.ingentaconnect.com/contentone/asp/nnl/2015/00000007/00000012/art00010
02/
Effects of Polyvinylpyrrolidone Molecular Weight on Adhesion Strength of Screen-Printed Cu Circuits to Polyimide Substrate
Kwang-Ho Jung, Bum-Geun Park, Seung-Boo Jung
Nanoscience and Nanotechnology Letters Vol.7 p.999 (2015)
http://www.ingentaconnect.com/contentone/asp/nnl/2015/00000007/00000012/art00011
03/
The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste
Kim, K.-S., Park, B.-G., Jung, K.-H., Jung, S.-B., Kim, J.-W.
Journal of Materials Science: Materials in Electronics Vol.26 p.8644 (2015)
http://link.springer.com/article/10.1007/s10854-015-3539-5
04/
Microwave sintering of silver nanoink for radio frequency applications
Kim, K.-S., Park, B.-G., Jung, K.-H., Kim, J.-W., Jeong, M.Y., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.15 p.2333 (2015)
http://www.ingentaconnect.com/content/asp/jnn/2015/00000015/00000003/art00059
05/
Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various
Lee, S.-M., Yoon, J.-W., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.26 p.1649 (2015)
http://link.springer.com/article/10.1007/s10854-014-2589-4
06/
Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints
Yoon, J.-W., Bang, J.-H., Lee, C.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.627 p.276 (2015)
http://www.sciencedirect.com/science/article/pii/S0925838814030230
07/
Hydrothermally grown in-doped zno nanorods on p-gan films for color-tunable heterojunction light-emitting-diodes
Park, G.C., Hwang, S.M., Lee, S.M., Choi, J.H., Song, K.M., Kim, H.Y., Kim, H.-S., Eum, S.-J., Jung, S.-B., Lim, J.H., Joo, J.
Scientific Reports Vol.5 p.10410 (2015)
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC4437377/
08/
High-temperature oxidation of AZ91D/Y2O3 magnesium composites in air
Youn, J.I., Kim, Y.J., Jung, S.B., Lee, D.B.
Science of Advanced Materials Vol.7 p.97 (2015)
http://www.ingentaconnect.com/content/asp/sam/2015/00000007/00000001/art00014
09/
Fabrication of SiCp/2024 composite alloys using friction stir welding and its mechanical properties
Ahn, B.-W., Choi, D.-H., Kim, J.-H., Yeon, Y.-M., Kim, D.-U., Shin, Y.-E., Jung, S.-B.
Science of Advanced Materials Vol.7 p.1535 (2015)
http://www.ingentaconnect.com/content/asp/sam/2015/00000007/00000008/art00018
10/
Fabrication of Ag-MWNT nanocomposite paste for high-power LED package
Kim, K.-S., Park, B.-G., Kim, H., Lee, H.-S., Jung, S.-B.
Current Applied Physics Vol.15 p.S36 (2015)
http://www.sciencedirect.com/science/article/pii/S1567173915000838
11/
Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes
Myung, W.-R., Kim, Y., Jung, S.-B.
Journal of Electronic Materials Vol.44 p.4637 (2015)
http://link.springer.com/article/10.1007/s11664-015-4024-x
12/
Enhancing Adhesion of Screen-Printed Silver Nanopaste Films
Kim, J.-H., Kim, K.-S., Jang, K.-R., Jung, S.-B., Kim, T.-S.
Advanced Materials Interfaces Vol.2 p.1500283 (2015)
http://onlinelibrary.wiley.com/doi/10.1002/admi.201500283/full
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Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder
Myung, W.-R., Ko, M.-K., Kim, Y., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.26 p.8707 (2015)
http://link.springer.com/article/10.1007/s10854-015-3546-6
14/
Effect of radio frequency plasma treatment on evaporation behavior and characteristics of RuCr alloy powder
Jung, T.-K., Lim, S.-C., Kwon, H.-C., Park, S.-K., Ho, J.-W., Jung, S.-B., Baek, J.-J., Jang, K.-B.
Journal of Nanoscience and Nanotechnology Vol.15 p.8424 (2015)
http://www.ingentaconnect.com/content/asp/jnn/2015/00000015/00000011/art00012
15/
Characteristics of Nanophase WC and WC-3 wt% (Ni, Co, and Fe) Alloys Using a Rapid Sintering Process for the Application of Friction Stir Processing Tools
Kim, D., Choi, Y., Kim, Y., Jung, S.
Application of Friction Stir Processing Tools
Advances in Materials Science and Engineering Vol.2015 p.343619 (2015)
https://www.hindawi.com/journals/amse/2015/343619/
2014
01/
Mechanical property of the epoxy-contained Sn-58Bi solder with OSP surface finish
Myung, W.-R., Kim, Y., Jung, S.-B.
Journal of Alloys and Compounds Vol.615 p.S411 (2014)
http://www.sciencedirect.com/science/article/pii/S0925838814001091
02/
Screen-printed Cu circuit for low-cost fabrication and its electrochemical migration characteristics
Jung, K.-H., Kim, K.-S., Park, B.-G., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.14 p.9493 (2014)
http://www.ingentaconnect.com/content/asp/jnn/2014/00000014/00000012/art00111
03/
Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test
Bui, Q.V., Jung, S.B.
Journal of Alloys and Compounds Vol.589 p.590 (2014)
http://www.sciencedirect.com/science/article/pii/S0925838813029411
04/
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns
Yoon, J.-W., Noh, B.-I., Jung, S.-B.
Microelectronics Reliability Vol.54 p.410 (2014)
http://www.sciencedirect.com/science/article/pii/S002627141300382X
05/
Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns
Koh, M., Kim, K.-S., Park, B.-G., Jung, K.-H., Lee, C.S., Choa, Y.-H., Jeong, M.Y., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.14 p.8915 (2014)
http://www.ingentaconnect.com/content/asp/jnn/2014/00000014/00000012/art00003
06/
Effect of surface finishes on electromigration reliability in eutectic Sn-58Bi solder joints
Kim, J.-H., Lee, Y.-C., Lee, S.-M., Jung, S.-B.
Microelectronic Engineering Vol.120 p.77 (2014)
http://www.sciencedirect.com/science/article/pii/S0167931713006941
07/
Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate
Yoon, J.-W., Noh, B.-I., Jung, S.-B.
Metals and Materials International Vol.20 p.515 (2014)
http://link.springer.com/article/10.1007/s12540-014-3016-3
08/
Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG
Bui, Q.V., Jung, S.B.
Journal of Materials Science: Materials in Electronics Vol.25 p.423 (2014)
http://link.springer.com/article/10.1007/s10854-013-1605-4
09/
Effect of atmospheric-pressure plasma treatment on the adhesion characteristics of screen-printed Ag nanoparticles on polyimide
Park, B.-G., Kim, K.-S., Jung, K.-H., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.14 p.9448 (2014)
http://www.ingentaconnect.com/content/asp/jnn/2014/00000014/00000012/art00103
10/
Effect of Ag nanowire addition into nanoparticle paste on the conductivity of Ag patterns printed by gravure offset method
Ok, K.-H., Lee, C.-J., Kwak, M.-G., Choi, D.-K., Kim, K.-S., Jung, S.-B., Kim, J.-W.
Journal of Nanoscience and Nanotechnology Vol.14 p.8808 (2014)
http://www.ingentaconnect.com/content/asp/jnn/2014/00000014/00000011/art00124
11/
Design and fabrication of screen-printed silver circuits for stretchable electronics
Kim, K.-S., Jung, K.-H., Jung, S.-B.
Microelectronic Engineering Vol.120 p.216 (2014)
http://www.sciencedirect.com/science/article/pii/S0167931713005522
2013
01/
Thermal and mechanical properties of flip chip package with Au stud bump
Ha, S.-S., Jung, S.-B.
Materials Transactions Vol.54 p.905 (2013)
http://jlc.jst.go.jp/DN/JALC/10019247020?from=Google
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The microstructures and mechanical properties of friction stir welded AZ31 with CaO Mg alloys
Choi, D.-H., Kim, S.-K., Jung, S.-B.
Journal of Alloys and Compounds Vol.554 p.162 (2013)
http://www.sciencedirect.com/science/article/pii/S092583881202138X
03/
The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma
Kim, K.-S., Bang, J.-O., Choa, Y.-H., Jung, S.-B.
Microelectronic Engineering Vol.107 p.121 (2013)
http://www.sciencedirect.com/science/article/pii/S016793171200487X
04/
Synthesis of Ag nanowires for the fabrication of transparent conductive electrode
Kim, J.-W., Lee, S.-W., Lee, Y., Jung, S.-B., Hong, S.-J., Kwak, M.-G.
Journal of Nanoscience and Nanotechnology Vol.13 p.6244 (2013)
http://www.ingentaconnect.com/content/asp/jnn/2013/00000013/00000009/art00057
05/
Reliability of chip on glass module fabricated with direct printing method
Lee, Y.-C., Kim, J.-W., Kim, Y., Jung, S.-B.
Microelectronic Engineering Vol.107 p.114 (2013)
http://www.sciencedirect.com/science/article/pii/S0167931712004893
06/
Microstructure and mechanical property of A356 based composite by friction stir processing
Choi, D.-H., Kim, Y.-H., Ahn, B.-W., Kim, Y.-I., Jung, S.-B.
Transactions of Nonferrous Metals Society of China (English Edition) Vol.23 p.335 (2013)
http://www.sciencedirect.com/science/article/pii/S1003632613624668
07/
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test
Yoon, J.-W., Ko, M.-K., Noh, B.-I., Jung, S.-B.
Microelectronics Reliability Vol.53 p.2036 (2013)
http://www.sciencedirect.com/science/article/pii/S0026271413001595
08/
Enhanced electrical and mechanical properties of silver nanoplatelet-based conductive features direct printed on a flexible substrate
Lee, Y.-I., Kim, S., Jung, S.-B., Myung, N.V., Choa, Y.-H.
ACS Applied Materials and Interfaces Vol.5 p.5908 (2013)
http://pubs.acs.org/doi/abs/10.1021/am401757y
09/
Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder
Noh, B.-I., Yoon, J.-W., Kim, K.-S., Kang, S., Jung, S.-B.
Microelectronic Engineering Vol.103 p.1 (2013)
http://www.sciencedirect.com/science/article/pii/S0167931712004753
10/
Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma
Kim, K.-S., Kwon, Y.-T., Choa, Y.-H., Jung, S.-B.
Microelectronic Engineering Vol.106 p.27 (2013)
http://www.sciencedirect.com/science/article/pii/S0167931713000701
11/
Electrochemical migration behavior of silver nanopaste screen-printed for flexible and printable electronics
Kim, K.-S., Bang, J.-O., Jung, S.-B.
Current Applied Physics Vol.13 p.S190 (2013)
http://www.sciencedirect.com/science/article/pii/S1567173913000618
12/
Effects of atmospheric pressure plasma surface treatments on the patternability and electrical property of screen-printed Ag nanopaste
Lee, Y.-C., Kim, J.-W., Yoon, J.-W., Yang, C.-W., Kim, Y., Jung, S.-B.
Metals and Materials International Vol.19 p.829 (2013)
http://link.springer.com/article/10.1007/s12540-013-4024-4
13/
Effect of surface treatment on the high-speed drop reliability of Pb-free solder interconnect
Kim, J.-W., Lee, H.-J., Jung, S.-B.
Thin Solid Films Vol.547 p.120 (2013)
http://www.sciencedirect.com/science/article/pii/S0040609013006925
14/
Characterization of reliability of printed indium tin oxide thin films
Hong, S.-J., Kim, J.-W., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.13 p.7770 (2013)
http://www.ingentaconnect.com/content/asp/jnn/2013/00000013/00000011/art00101
15/
Characterization of low speed shear test reliability of Sn-1.0Ag-XCe/ENEPIG solder joint
Bui, Q.V., Jung, S.B.
Journal of Alloys and Compounds Vol.560 p.54 (2013)
http://www.sciencedirect.com/science/article/pii/S0925838813000662
16/
Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance
Kim, K.-S., Jung, K.-H., Park, B.-G., Shin, Y.-E., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.13 p.7620 (2013)
http://www.ingentaconnect.com/content/asp/jnn/2013/00000013/00000011/art00073
17/
Characteristics of microstructure, microhardness, and oxidation of FSW and MIG welded steels
Kim, S.K., Jung, S.B., Lee, D.B.
Chiang Mai Journal of Science Vol.40 p.831 (2013)
18/
Behavior of β phase (Al3Mg2) in AA 5083 during friction stir welding
Choi, D.-H., Ahn, B.-W., Quesnel, D.J., Jung, S.-B.
Intermetallics Vol.35 p.120 (2013)
http://www.sciencedirect.com/science/article/pii/S096697951200444X
2012
01/
Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate
Kim, K.-S., Kim, Y., Jung, S.-B.
Nanoscale Research Letters (2012)
http://link.springer.com/article/10.1186/1556-276X-7-49
02/
Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders
Yoon, J.-W., Lee, J.-G., Lee, J.-B., Noh, B.-I., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.23 p.41 (2012)
http://link.springer.com/article/10.1007/s10854-011-0402-1
03/
Thermal resistance of light emitting diode PCB with thermal vias
Lee, H.S., Shin, H.W., Jung, S.B.
Journal of Nanoscience and Nanotechnology Vol.12 p.3210 (2012)
http://www.ingentaconnect.com/content/asp/jnn/2012/00000012/00000004/art00041
04/
The influence of MWNT composite on the stretchability of conductive nanopaste screen-printed on elastomeric substrate
Kim, K.-S., Bui, Q.V., Lee, J.-B., Jung, S.-B.
Current Applied Physics Vol.12 p.S99 (2012)
http://www.sciencedirect.com/science/article/pii/S1567173912000582
05/
Microstructures and properties of friction stir welded 409L stainless steel using a Si 3N 4 tool
Ahn, B.W., Choi, D.H., Kim, D.J., Jung, S.B.
Materials Science and Engineering A Vol.532 p.476 (2012)
http://www.sciencedirect.com/science/article/pii/S0921509311012263
06/
Microstructures and mechanical properties of friction stir welded 2.25Cr-1Mo steel
Choi, D.-H., Ahn, B.-W., Yeon, Y.-M., Jung, S.-B.
Materials Transactions Vol.53 p.1022 (2012)
http://jlc.jst.go.jp/DN/JALC/10000094695?from=Google
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Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test
Cho, I., Ahn, J.-H., Yoon, J.-W., Shin, Y.-E., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.23 p.1515 (2012)
http://link.springer.com/article/10.1007/s10854-012-0621-0
08/
Fabrication of SiCp/AA5083 composite via friction stir welding
Ahn, B.-W., Choi, D.-H., Kim, Y.-H., Jung, S.-B.
Transactions of Nonferrous Metals Society of China (English Edition) Vol.22 p.s634 (2012)
http://www.sciencedirect.com/science/article/pii/S1003632612617774
09/
Evaluation of drop reliability of Sn-37Pb solder/Cu joints using a high speed lap-shear test
Jeon, S.-J., Kim, J.-W., Lee, B., Lee, H.-J., Jung, S.-B., Hyun, S., Lee, H.-J.
Microelectronic Engineering Vol.91 p.147 (2012)
http://www.sciencedirect.com/science/article/pii/S0167931711006745
10/
Electrochemical migration characteristics of screen-printed silver patterns on FR-4 substrate
Kim, K.-S., Ahn, J.-H., Noh, B.-I., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.12 p.3219 (2012)
http://www.ingentaconnect.com/content/asp/jnn/2012/00000012/00000004/art00043
11/
Electrochemical migration behavior of silver nanopaste screen-printed for flexible and printable electronics
Kim, K.-S., Bang, J.-O., Jung, S.-B.
Current Applied Physics Vol.13 p.S190 (2013)
http://www.sciencedirect.com/science/article/pii/S1567173913000618
12/
Effects of sintering conditions on microstructure and characteristics of screen-printed Ag thin film
Kim, K.-S., Myung, W.-R., Jung, S.-B.
Electronic Materials Letters Vol.8 p.309 (2012)
http://link.springer.com/article/10.1007/s13391-012-1102-6
13/
Effects of plasma polymerized acrylic acid film on the adhesion of Ag tracks screen-printed on polyimide
Kim, K.-S., Myung, W.-R., Jung, S.-B.
Journal of Adhesion Vol.88 p.337 (2012)
2012.660025 target=_blank>http://www.tandfonline.com/doi/abs/10.1080/00218464.2012.660025
14/
Effect of sintering temperature on electrical properties of chip on glass module with direct printing method
Lee, Y.-C., Kim, Y., Jung, S.-B.
Japanese Journal of Applied Physics Vol.51 (2012)
http://iopscience.iop.org/article/10.1143/JJAP.51.09MJ04/meta
15/
Effect of SiC particles on microstructure and mechanical property of friction stir processed
Choi, D.-H., Kim, Y.-I., Kim, D.-U., Jung, S.-B.
Transactions of Nonferrous Metals Society of China (English Edition) Vol.22 p.s614 (2012)
http://www.sciencedirect.com/science/article/pii/S1003632612617737
16/
Effect of heat treatment on mechanical reliability of solder joints in LED package
Ko, M.-K., Ahn, J.-H., Lee, Y.-C., Kim, K.-S., Yoon, J.-W., Jung, S.-B.
Journal of Korean Institute of Metals and Materials Vol.50 p.71 (2012)
17/
Effect of gold immersion time on the electrochemical migration property of electroless nickel/immersion gold surface finishing
Bui, Q.V., Yoon, J.-W., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.12 p.3506 (2012)
2012/00000012/00000004/art00107 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2012/00000012/00000004/art00107
18/
Ductile fracture mechanism of low-temperature in-48Sn alloy joint under high strain rate loading
Kim, J.-W., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.12 p.3259 (2012)
2012/00000012/00000004/art00052 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2012/00000012/00000004/art00052
19/
Adhesion characteristics of silver tracks screen-printed on polyimide with an environmental
Kim, K.-S., Myung, W.-R., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.12 p.5769 (2012)
2012/00000012/00000007/art00120 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2012/00000012/00000007/art00120
2011
01/
In situ TEM characterization of interfacial reaction in Sn-3.5Ag/electroless Ni(P) solder joint
Kang, H.-B., Bae, J.-H., Yoon, J.-W., Jung, S.-B., Park, J., Yang, C.-W.
Scripta Materialia Vol.64 p.597 (2011)
http://www.sciencedirect.com/science/article/pii/S1359646210007657
02/
Hybrid Friction Stir Welding of High-carbon Steel
Choi, D.-H., Lee, C.-Y., Ahn, B.-W., Choi, J.-H., Yeon, Y.-M., Song, K., Hong, S.-G., Lee, W.-B., Kang, K.-B., Jung, S.-B.
Journal of Materials Science and Technology Vol.27 p.127 (2011)
http://www.sciencedirect.com/science/article/pii/S1005030211600376
03/
High frequency characteristics of printed Cu conductive circuit
Kim, J.-W., Lee, Y.-C., Kim, K.-S., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.11 p.537 (2011)
2011/00000011/00000001/art00092 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2011/00000011/00000001/art00092
04/
Formation of intermetallic compounds in Al and Mg alloy interface during friction stir spot welding
Choi, D.-H., Ahn, B.-W., Lee, C.-Y., Yeon, Y.-M., Song, K., Jung, S.-B.
Intermetallics Vol.19 p.125 (2011)
http://www.sciencedirect.com/science/article/pii/S0966979510003699
05/
Flexibility of silver conductive circuits screen-printed on a polyimide substrate
Kim, K.-S., Lee, Y.-C., Kim, J.-W., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.11 p.1493 (2011)
2011/00000011/00000002/art00103 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2011/00000011/00000002/art00103
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Fabrication and adhesion strength of Cu/Ni-Cr/polyimide films for flexible printed circuits
Noh, B.-I., Yoon, J.-W., Jung, S.-B.
Microelectronic Engineering Vol.88 p.1024 (2011)
http://www.sciencedirect.com/science/article/pii/S0167931711000967
07/
Evaluation of the flexibility of silver circuits screen-printed on polyimide with an environmental reliability test
Kim, K.-S., Lee, Y.-C., Ahn, J.-H., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.11 p.5806 (2011)
2011/00000011/00000007/art00036 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2011/00000011/00000007/art00036
08/
Electrical characterization of differential stretchable transmission line
Jeon, J.-W., Kim, S.-K., Koo, J.-M., Hong, S.-M., Moon, Y.-J., Jung, S.-B., Kim, B.-S.
IEEE MTT-S International Microwave Symposium Digest p.5972938 (2011)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5972938
09/
Electrical characteristics of printed Ag nanopaste on polyimide substrate
Lee, Y.-C., Kim, K.-S., Kim, J.-W., Kim, J.-M., Nah, W., Lee, S.-H., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.11 p.1468 (2011)
2011/00000011/00000002/art00097 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2011/00000011/00000002/art00097
10/
Effects of different kinds of underfills and temperature-humidity treatments on drop reliability of board-level packages
Noh, B.-I., Yoon, J.-W., Ha, S.-O., Jung, S.-B.
Journal of Electronic Materials Vol.40 p.224 (2011)
http://link.springer.com/article/10.1007/s11664-010-1423-x
11/
Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits
Noh, B.-I., Yoon, J.-W., Lee, B.-Y., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.22 p.790 (2011)
http://link.springer.com/article/10.1007/s10854-010-0213-9
12/
Effect of thermal treatment on adhesion strength of Cu/Ni-Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process
Noh, B.-I., Yoon, J.-W., Choi, J.-H., Jung, S.-B.
Microelectronic Engineering Vol.88 p.718 (2011)
http://www.sciencedirect.com/science/article/pii/S0167931710002303
13/
Effect of sintering temperature on electrical characteristics of screen-printed Ag nanopaste on FR4 substrate
Lee, Y.-C., Ahn, J.-H., Kim, K.-S., Yoon, J.-W., Kim, J.-W., Kim, Y., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.11 p.5915 (2011)
2011/00000011/00000007/art00056 target=_blank>http://www.ingentaconnect.com/content/asp/jnn/2011/00000011/00000007/art00056
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Effect of peak current density on the mechanical and electrical properties of copper/polymide fabricated by a pulsed electrodeposition process
Lee, C.M., Hwang, S.M., Park, G.C., Kim, J.C., Lim, J.H., Joo, J., Jung, S.-B., Kim, Y.S.
Current Applied Physics Vol.11 p.S128 (2011)
http://www.sciencedirect.com/science/article/pii/S1567173911003956
15/
Effect of Pd addition in ENIG surface finish on drop reliability of Sn-Ag-Cu solder joint
Ha, S.-S., Park, J., Jung, S.-B.
Materials Transactions Vol.52 p.1553 (2011)
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Effect of non-conductive film on the reliability of multi-chip package bonded using ultrasonic energy
Lee, J.-B., Lee, J.-G., Ha, S.-S., Jung, S.-B.
Journal of Adhesion Science and Technology Vol.25 p.2475 (2011)
http://www.tandfonline.com/doi/abs/10.1163/016942411X580153
17/
Effect of heat treatment on physical and electrical characteristics of conductive circuits printed on Si substrate
Kim, J.-W., Jeon, B.-K., Lee, S.-W., Hong, S.-J., Kim, Y.-S., Kwak, M.-G., Kang, N.K., Lee, Y.-C., Jung, S.-B.
Microelectronic Engineering Vol.88 p.791 (2011)
http://www.sciencedirect.com/science/article/pii/S0167931710002352
18/
Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish
Bui, Q.V., Nam, N.D., Yoon, J.W., Choi, D.H., Kar, A., Kim, J.G., Jung, S.B.
Journal of Electronic Materials Vol.40 p.1937 (2011)
http://link.springer.com/article/10.1007/s11664-011-1682-1
19/
Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu
Yoon, J.-W., Noh, B.-I., Choi, J.-H., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.22 p.745 (2011)
http://link.springer.com/article/10.1007/s10854-010-0204-x
20/
Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material
Shin, J.-S., Moon, H.-K., Kim, B.-H., Kim, K.-H., Lee, H.-S., Jung, S.-B., Kwon, H.-C.
Current Applied Physics Vol.11 p.S283 (2011)
http://www.sciencedirect.com/science/article/pii/S1567173910004852
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Comparative study of ENIG and ENEPIG as surface finishes for a Sn-Ag-Cu solder joint
Yoon, J.-W., Noh, B.-I., Jung, S.-B.
Journal of Electronic Materials Vol.40 p.1950 (2011)
http://link.springer.com/article/10.1007/s11664-011-1686-x
22/
Analysis of thermo-mechanical behavior of ITO layer on PET substrate
Lee, H.-S., Bang, J.-O., Lee, H.-J., Lee, G.-J., Chai, K.-H., Jung, S.-B.
Proceedings - Electronic Components and Technology Conference p.1796 (2011)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5898757
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A study on adhesive properties of a damascene electroplated Cu composite sheet
Moon, H., Jung, S.-B., Shin, J.
Materials Science Forum Vol.695 p.577 (2011)
http://www.scientific.net/MSF.695.577
2010
01/
Effect of Cr thickness on adhesion strength of Cu/Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process
Noh, B.-I., Yoon, J.-W., Choi, J.-H., Jung, S.-B.
Materials Transactions Vol.51 p.85 (2010)
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Effect of Ag addition on the corrosion properties of Sn-based solder alloys
Bui, Q.V., Nam, N.D., Noh, B.-I., Kar, A., Kim, J.-G., Jung, S.-B.
Materials and Corrosion Vol.61 p.30 (2010)
http://onlinelibrary.wiley.com/doi/10.1002/maco.200905237/full
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Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer
Noh, B.-I., Yoon, J.W., Jung, S.B.
International Journal of Adhesion and Adhesives Vol.30 p.30 (2010)
http://www.sciencedirect.com/science/article/pii/S0143749609000645
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Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading
Kim, J.-W., Jung, S.-B.
Metals and Materials International Vol.16 p.7 (2010)
http://link.springer.com/article/10.1007/s12540-010-0007-x
05/
Structure-properties relations in friction stir spot welded low carbon steel sheets for light weight automobile body
Baek, S.-W., Choi, D.-H., Lee, C.-Y., Ahn, B.-W., Yeon, Y.-M., Song, K., Jung, S.-B.
Materials Transactions Vol.51 p.399 (2010)
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Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package
Ha, S.-S., Jang, J.-K., Ha, S.-O., Yoon, J.-W., Lee, H.-J., Joo, J.-H., Kim, Y.-H., Jung, S.-B.
Microelectronic Engineering Vol.87 p.517 (2010)
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Mechanical reliability of Sn-Ag BGA solder joints with various electroless Ni-P and Ni-B plating layers
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IEEE Transactions on Components and Packaging Technologies Vol.33 p.222 (2010)
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Characterization of direct patterned Ag circuits for RF application
Kim, J.-W., Lee, Y.-C., Kim, J.-M., Nah, W., Lee, H.-S., Kwon, H.-C., Jung, S.-B.
Microelectronic Engineering Vol.87 p.379 (2010)
http://www.sciencedirect.com/science/article/pii/S0167931709004778
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Corrosion protection of ENIG surface finishing using electrochemical methods
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Materials Research Bulletin Vol.45 p.305 (2010)
http://www.sciencedirect.com/science/article/pii/S0025540809003511
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Comparison of interfacial stability of Pb-free solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-0.7Cu) on ENIG-plated Cu during aging
Yoon, J.-W., Noh, B.-I., Jung, S.-B.
IEEE Transactions on Components and Packaging Technologies Vol.33 p.64 (2010)
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Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar
Yoon, J.-W., Noh, B.-I., Jung, S.-B.
Journal of Materials Science: Materials in Electronics (2010)
http://link.springer.com/article/10.1007/s10854-010-0089-8
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Reliability of fine-pitch flip-chip (COG) bonding with non-conductive film using ultrasonic energy
Jo, J.-L., Lee, J.-B., Kim, J.-M., Shin, Y.-E., Jung, S.-B.
Journal of Adhesion Vol.86 p.470 (2010)
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Microstructure and mechanical properties of friction stir spot welded galvanized steel
Baek, S.-W., Choi, D.-H., Lee, C.-Y., Ahn, B.-W., Yeon, Y.-M., Song, K., Jung, S.-B.
Materials Transactions Vol.51 p.1044 (2010)
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Effect of fixed location variation in friction stir welding of steels with different carbon contents
Choi, D.-H., Lee, C.-Y., Ahn, B.-W., Yeon, Y.-M., Park, S.-H.C., Sato, Y.-S., Kokawa, H., Jung, S.-B.
Science and Technology of Welding and Joining Vol.15 p.299 (2010)
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Electromigration behavior of through-si-via (TSV) interconnect for 3-D flip chip packaging
Ha, S.-S., Yang, J.-M., Jung, S.-B.
Materials Transactions Vol.51 p.1020 (2010)
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Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys
Noh, B.-I., Choi, J.-H., Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.499 p.154 (2010)
http://www.sciencedirect.com/science/article/pii/S0925838810007000
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Variation of heat dissipation properties of LED packages with thermal vias
Lee, H.S., Shin, H.W., Jung, S.B.
Materials Science Forum Vol.654-656 p.2811 (2010)
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Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints
Yoon, J.-W., Noh, B.-I., Jung, S.-B.
Journal of Alloys and Compounds Vol.506 p.331 (2010)
http://www.sciencedirect.com/science/article/pii/S0925838810016828
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A new non-PRM bumping process by electroplating on Si Die for three dimensional packaging
Jun, J., Kim, I., Mayer, M., Norman Zhou, Y., Jung, S., Jung, J.
Materials Transactions Vol.51 p.1887 (2010)
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Effect of Ni-Cr seed layer thickness on the adhesion characteristics of flexible copper clad laminates fabricated using a roll-to-roll process
Noh, B.-I., Yoon, J.-W., Jung, S.-B.
Metals and Materials International Vol.16 p.779 (2010)
http://link.springer.com/article/10.1007/s12540-010-1013-8
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Characterization of ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/ electroless Ni (P) solder joint
Kang, H.-B., Bae, J.-H., Yoon, J.-W., Jung, S.-B., Park, J., Yang, C.-W.
Scripta Materialia Vol.63 p.1108 (2010)
http://www.sciencedirect.com/science/article/pii/S1359646210005610
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Effect of process parameters on TSV formation using deep reactive ion etching
Kim, K.-S., Lee, Y.-C., Ahn, J.-H., Song, J.Y., Yoo, C.D., Jung, S.-B.
Journal of Korean Institute of Metals and Materials Vol.48 p.1028 (2010)
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Effect of process parameters on TSV formation using deep reactive ion etching
Lee, Y.-C., Kim, K.-S., Ahn, J.-H., Yoon, J.-W., Ko, M.-K., Jung, S.-B.
Journal of Korean Institute of Metals and Materials Vol.48 p.1035 (2010)
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Thermal resistivity properties of LED packages with thermal via
Lee, H.S., Shin, H.W., Jung, S.B.
Advanced Materials Research Vol.12-125 p.511 (2010)
http://www.scientific.net/AMR.123-125.511
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The dependence of PET layer on the thermal stability of PET-ITO substrate for mobile electronics
Lee, H.-S., Bang, J.O., An, K.J., Jung, S.B., Chai, K.H.
Advanced Materials Research Vol.12-125 p.503 (2010)
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Effects of chemical etching and functionalization times on the properties of Cu/Polyimide films
Sung, K., Hwang, S.M., Lee, C.M., Kim, W., Lee, S.M., Park, G.C., Jung, S.-B., Joo, J., Lim, J.H.
Journal of the Korean Physical Society Vol.57 p.1707 (2010)
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2009
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Failure behaviors of flip chip solder joints under various loading conditions of high-speed shear test
Ha, S.S., Ha, S.-O., Jang, J.-K., Kim, J.-W., Lee, J.-B., Jung, S.-B.
International Journal of Modern Physics B Vol.23 p.1809 (2009)
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Effects of underfill materials and thermal cycling on mechanical reliability of chip scale package
Noh, B.-I., Yoon, J.-W., Jung, S.-B.
IEEE Transactions on Components and Packaging Technologies Vol.32 p.633 (2009)
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Effect of surface finish on mechanical and electrical properties of Sn-3.5Ag ball grid array (BGA) solder joint with multiple reflow
Sung, J.-Y., Pyo, S.-E., Koo, J.-M., Yoon, J.-W., Shin, Y.-E., Jung, S.-B.
Journal of Korean Institute of Metals and Materials Vol.47 p.261 (2009)
04/
Dissimilar friction stir spot welding of low carbon steel and Al-Mg alloy by formation of IMCs
Lee, C.-Y., Choi, D.-H., Yeon, Y.-M., Jung, S.-B.
Science and Technology of Welding and Joining Vol.14 p.216 (2009)
http://www.maneyonline.com/doi/abs/10.1179/136217109X400439
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Electrical characterization of screen-printed conductive circuit with silver nanopaste
Kim, J.-W., Jung, S.-B.
Japanese Journal of Applied Physics Vol.48 p.06FD141 (2009)
http://iopscience.iop.org/article/10.1143/JJAP.48.06FD14/meta
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Fabrication and characterization of the mgb2 bulk superconductors doped by carbon nanotubes
Lim, J.H., Lee, C.M., Park, J.H., Kim, W., Joo, J., Jung, S.-B., Lee, Y.H., Kim, C.-J.
IEEE Transactions on Applied Superconductivity Vol.19 p.2767 (2009)
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Effect of surface treatment on the mechanical strength of ultrasonically bonded chip on copper-coated glass for ultra-fine pitch application in microelectronics
Jo, J.-L., Lee, J.-B., Lee, J.-G., Jeon, S.-H., Kim, J.-M., Shin, Y.-E., Moon, J.-H., Yoo, C.-D., Jung, S.-B.
Japanese Journal of Applied Physics Vol.48 p.07GA07 (2009)
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Effect of time and pressure on ultrasonic bonding strength of flexible printed circuit board to glass with nonconductive film
Lee, J.-B., Lee, J.-G., Jo, J.-L., Koo, J.-M., Chun, C.-K., Jung, S.-B.
Japanese Journal of Applied Physics Vol.48 p.07GA08 (2009)
http://iopscience.iop.org/article/10.1143/JJAP.48.07GA08/meta
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Characterization of flexible copper laminates fabricated by Cu electro-plating process
LEE, C.-M., LIM, J.-H., HWANG, S.-M., PARK, E.-C., SHIM, J.-H., PARK, J.-H., JOO, J., JUNG, S.-B.
Transactions of Nonferrous Metals Society of China (English Edition) Vol.19 p.965 (2009)
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Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test
Ha, S.-S., Ha, S.-O., Yoon, J.-W., Kim, J.-W., Ko, M.-K., Kim, D.-G., Kim, S.-J., Hong, T.-H., Jung, S.-B.
Metals and Materials International Vol.15 p.655 (2009)
http://link.springer.com/article/10.1007/s12540-009-0655-x
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Fabrication of two-layer flexible copper clad laminate by electroless-Cu plating on surface modified polyimide
HWANG, S.-M., LIM, J.-H., LEE, C.-M., PARK, E.-C., CHOI, J.-H., JOO, J., LEE, H.-J., JUNG, S.-B.
Transactions of Nonferrous Metals Society of China (English Edition) Vol.19 p.970 (2009)
http://www.sciencedirect.com/science/article/pii/S100363260860388X
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Ultrasonic bonding of electrodes of rigid and flexible printed circuit boards with non-conductive film (NCF)
Lee, J.-B., Koo, J.-M., Kim, J.-W., Noh, B.-I., Lee, J.-G., Jung, S.-B.
Journal of Adhesion Vol.85 p.341 (2009)
http://www.tandfonline.com/doi/abs/10.1080/00218460902880198
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Reliability of Au bump flip chip packages with adhesive materials using four-point bending test
Noh, B.-I., Yoon, J.-W., Kim, J.-W., Lee, J.-B., Park, N.-C., Hong, W.-S., Jung, S.-B.
International Journal of Adhesion and Adhesives Vol.29 p.650 (2009)
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Frictional wear evaluation of WC-Co alloy tool in friction stir spot welding of low carbon steel plates
Choi, D.H., Lee, C.Y., Ahn, B.W., Choi, J.H., Yeon, Y.M., Song, K., Park, H.S., Kim, Y.J., Yoo, C.D., Jung, S.B.
International Journal of Refractory Metals and Hard Materials Vol.27 p.931 (2009)
http://www.sciencedirect.com/science/article/pii/S0263436809000729
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Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints
Yoon, J.-W., Noh, B.-I., Kim, B.-K., Shur, C.-C., Jung, S.-B.
Journal of Alloys and Compounds Vol.486 p.142 (2009)
http://www.sciencedirect.com/science/article/pii/S0925838809013103
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Mechanical property evaluation of Sn-3.0A-0.5Cu BGA solder joints using high-speed ball shear test
Ha, S.-S., Jang, J.-K., Ha, S.-O., Kim, J.-W., Yoon, J.-W., Kim, B.-W., Park, S.-K., Jung, S.-B.
Journal of Electronic Materials Vol.38 p.2489 (2009)
http://link.springer.com/article/10.1007/s11664-009-0916-y
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Interfacial reaction and mechanical reliability of eutectic Sn-0̇7Cu/immersion Ag-plated Cu solder joint
Yoon, J.-W., Jung, S.-B.
Materials Science and Technology Vol.25 p.1478 (2009)
http://www.tandfonline.com/doi/abs/10.1179/174328408X374739
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Electromigration behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu flip-chip solder joints under high current density
Ha, S.-S., Kim, J.-W., Yoon, J.-W., Ha, S.-O., Jung, S.-B.
Journal of Electronic Materials Vol.38 p.70 (2009)
http://link.springer.com/article/10.1007/s11664-008-0574-5
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Adhesion characteristics of Cu/Ni-Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness
Noh, B.-I., Yoon, J.-W., Lee, B.-Y., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.20 p.885 (2009)
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Effect of Ni-Cr layer on adhesion strength of flexible copper clad laminate
Noh, B.-I., Jung, S.-B.
Journal of Electronic Materials Vol.38 p.46 (2009)
http://link.springer.com/article/10.1007/s11664-008-0543-z
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Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test
Kim, J.-W., Lee, Y.-C., Ha, S.-S., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.20 p.17 (2009)
http://link.springer.com/article/10.1007/s10854-008-9588-2
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Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints
Kang, H.-B., Bae, J.-H., Lee, J.-W., Park, M.-H., Lee, Y.-C., Yoon, J.-W., Jung, S.-B., Yang, C.-W.
Scripta Materialia Vol.60 p.257 (2009)
http://www.sciencedirect.com/science/article/pii/S1359646208007549
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Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint
Yoon, J.-W., Chun, H.-S., Jung, S.-B.
Journal of Alloys and Compounds Vol.469 p.108 (2009)
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Effect of additives on microstructure and mechanical properties of nickel plate/mask fabricated by electroforming process
Lim, J.H., Park, E.C., Joo, J., Jung, S.-B.
Journal of the Electrochemical Society Vol.156 p.D108 (2009)
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Transmission property of flip chip package with adhesive interconnection for RF applications
Kim, J.-W., Nah, W., Jung, S.-B.
Microelectronic Engineering Vol.86 p.314 (2009)
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Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes
Noh, B.-I., Yoon, J.-W., Hong, W.-S., Jung, S.-B.
Journal of Electronic Materials Vol.38 p.902 (2009)
http://link.springer.com/article/10.1007/s11664-009-0737-z
2008
01/
Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification
Yoon, S.S., Kim, D.O., Park, S.C., Lee, Y.K., Chae, H.Y., Jung, S.B., Nam, J.-D.
Microelectronic Engineering Vol.85 p.136 (2008)
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Microwave performance of flip chip interconnects with anisotropic and non-conductive films
Kim, J.-W., Lee, Y.-C., Ko, J.-H., Nah, W., Jeong, M.Y., Kwon, H.-C., Jung, S.-B.
Journal of Adhesion Science and Technology Vol.22 p.1339 (2008)
http://www.tandfonline.com/doi/abs/10.1163/156856108X309486
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Evaluation of thermal and hygro-thermal behaviors of flip chip packages with a non-conductive paste
Noh, B.-I., Lee, J.-B., Kim, J.-W., Jung, S.-B.
Evaluation of thermal and hygro-thermal behaviors of flip chip packages with a non-conductive paste
Journal of Adhesion Science and Technology Vol.22 p.1355 (2008)
http://www.tandfonline.com/doi/abs/10.1163/156856108X309512
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Evaluation of thermal and hygro-thermal behaviors of flip chip packages with a non-conductive paste
Noh, B.-I., Lee, J.-B., Kim, J.-W., Jung, S.-B.
Journal of Adhesion Science and Technology Vol.22 p.1355 (2008)
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Mechanical and electrical properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) solder joints after multiple reflows
Koo, J.-M., Vu, B.Q., Kim, Y.-N., Lee, J.-B., Kim, J.-W., Kim, D.-U., Moon, J.-H., Jung, S.-B.
Journal of Electronic Materials Vol.37 p.118 (2008)
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Electrical characterization of adhesive flip chip interconnects for microwave application
Kim, J.-W., Lee, Y.-C., Ha, S.-S., Koo, J.-M., Ko, J.-H., Nah, W., Jung, S.-B.
Journal of Micro/Nanolithography, MEMS, and MOEMS Vol.7 (2008)
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Effect of under bump metallization (UBM) on interfacial reaction and shear strength of electroplated pure tin solder bump
Kim, Y.-N., Koo, J.-M., Park, S.-K., Jung, S.-B.
Journal of Korean Institute of Metals and Materials Vol.46 p.33 (2008)
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Reliability of conductive adhesives as a Pb-free alternative in flip-chip applications
Kim, J.-W., Lee, Y.-C., Jung, S.-B.
Journal of Electronic Materials Vol.37 p.9 (2008)
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Electrical properties and interfacial reaction of BGA package with underfill
Noh, B.-I., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.19 p.75 (2008)
http://link.springer.com/article/10.1007/s10854-007-9282-9
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Characterization of interfacial reaction layers formed between Sn-3.5Ag solder and electroless Ni-immersion Au-plated Cu substrates
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Journal of Electronic Materials Vol.37 p.84 (2008)
http://link.springer.com/article/10.1007/s11664-007-0262-x
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Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu(ENIG) sandwich solder joints
Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.448 p.177 (2008)
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Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au
Yoon, J.-W., Chun, H.-S., Jung, S.-B.
Materials Science and Engineering A Vol.473 p.119 (2008)
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Atmospheric pressure plasma cleaning of gold flip chip bump for ultrasonic flip chip bonding
Koo, J.-M., Lee, J.-B., Moon, Y.J., Moon, W.-C., Jung, S.-B.
Journal of Physics: Conference Series Vol.100 (2008)
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Analysis of failure mechanism in anisotropic conductive and non-conductive film interconnections
Kim, J.-W., Kim, D.-G., Lee, Y.-C., Jung, S.-B.
IEEE Transactions on Components and Packaging Technologies Vol.31 p.65 (2008)
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Microstructures and mechanical properties of double-friction stir welded 2219 Al alloy
Lee, C.-Y., Choi, D.-H., Lee, W.-B., Park, S.-K., Yeon, Y.-M., Jung, S.-B.
Materials Transactions Vol.49 p.885 (2008)
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Effect of surface finish material on printed circuit board for electrochemical migration
Noh, B.-I., Lee, J.-B., Jung, S.-B.
Microelectronics Reliability Vol.48 p.652 (2008)
http://www.sciencedirect.com/science/article/pii/S0026271407004283
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Effect of CaO on AZ31 Mg strip castings
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Materials Transactions Vol.49 p.976 (2008)
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Effect of underfill on bending fatigue behavior of chip scale package
Noh, B.-I., Park, N.-C., Hong, W.-S., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.19 p.406 (2008)
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Lap joint properties of FSWed dissimilar formed 5052 Al and 6061 Al alloys with different thickness
Lee, C.-Y., Lee, W.-B., Kim, J.-W., Choi, D.-H., Yeon, Y.-M., Jung, S.-B.
Journal of Materials Science Vol.43 p.3296 (2008)
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Application of underfill for flip-chip package using ultrasonic bonding
Noh, B.-I., Koo, J.-M., Jo, J.-L., Jung, S.-B.
Japanese Journal of Applied Physics Vol.47 p.4257 (2008)
http://iopscience.iop.org/article/10.1143/JJAP.47.4257/meta
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Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards
Lee, J.-B., Koo, J.-M., Hong, S.-M., Shin, H., Moon, Y.-J., Jung, J.-P., Yoo, C.-D., Jung, S.-B.
Japanese Journal of Applied Physics Vol.47 p.4300 (2008)
http://iopscience.iop.org/article/10.1143/JJAP.47.4300/meta
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Effect of atmospheric pressure plasma treatment on transverse ultrasonic bonding of gold flip-chip bump on glass substrate
Koo, J.-M., Jo, J.-L., Lee, J.-B., Kim, Y.-N., Kim, J.-W., Noh, B.-I., Moon, J.-H., Kim, D.-U., Jung, S.-B.
Japanese Journal of Applied Physics Vol.47 p.4309 (2008)
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Effect of bonding conditions on conduction behavior of anisotropic conductive film interconnection
Kim, J.-W., Lee, Y.-C., Jung, S.-B.
Metals and Materials International Vol.14 p.373 (2008)
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Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows
Koo, J.-M., Yoon, J.-W., Jung, S.-B.
Journal of Materials Research Vol.23 p.1631 (2008)
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Effect of Zn addition on mechanical properties of brass hollow spheres
Koo, J.-M., Araki, H., Jung, S.-B.
Materials Science and Engineering A Vol.483-484 p.254 (2008)
http://www.sciencedirect.com/science/article/pii/S0921509307008994
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Surface finishes of rolled copper foil for flexible printed circuit board
Lee, C.-Y., Moon, W.-C., Jung, S.-B.
Materials Science and Engineering A Vol.483-484 p.723 (2008)
http://www.sciencedirect.com/science/article/pii/S0921509307009951
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Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages
Koo, J.-M., Kim, Y.-N., Yoon, J.-W., Kim, D.-G., Noh, B.-I., Kim, J.-W., Moon, J.-H., Jung, S.-B.
Materials Science and Engineering A Vol.483-484 p.620 (2008)
http://www.sciencedirect.com/science/article/pii/S0921509307008799
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Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints
Yoon, J.-W., Chun, H.-S., Jung, S.-B.
Materials Science and Engineering A Vol.483-484 p.731 (2008)
http://www.sciencedirect.com/science/article/pii/S0921509307009847
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Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill
Noh, B.-I., Lee, B.-Y., Jung, S.-B.
Materials Science and Engineering A Vol.483-484 p.464 (2008)
http://www.sciencedirect.com/science/article/pii/S0921509307009938
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Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn-3.5Ag-0.7Cu solder joint
Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.458 p.200 (2008)
http://www.sciencedirect.com/science/article/pii/S0925838807008134
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Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints
Kim, D.-G., Kim, J.-W., Ha, S.-S., Noh, B.-I., Koo, J.-M., Park, D.-W., Ko, M.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.458 p.253 (2008)
http://www.sciencedirect.com/science/article/pii/S0925838807008511
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Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system
Kang, H.-B., Lee, J.-W., Bae, J.-H., Park, M.-H., Yoon, J.-W., Jung, S.-B., Ju, J.-S., Yang, C.-W.
Journal of Materials Research Vol.23 p.2195 (2008)
http://journals.cambridge.org/abstract_S0884291400029903
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Thermal degradation of anisotropic conductive film joints under temperature fluctuation
Kim, J.-W., Koo, J.-M., Lee, C.-Y., Noh, B.-I., Yoon, J.-W., Kim, D.-G., Park, S.-K., Jung, S.-B.
International Journal of Adhesion and Adhesives Vol.28 p.314 (2008)
http://www.sciencedirect.com/science/article/pii/S0143749607000991
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Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test
Jeon, S.-j., Hyun, S., Lee, H.-J., Kim, J.-W., Ha, S.-S., Yoon, J.-W., Jung, S.-B., Lee, H.-J.
Microelectronic Engineering Vol.85 p.1967 (2008)
http://www.sciencedirect.com/science/article/pii/S016793170800302X
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Characteristics of environmental factor for electrochemical migration on printed circuit board
Noh, B.-I., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.19 p.952 (2008)
http://link.springer.com/article/10.1007/s10854-007-9421-3
36/
Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder
Yoon, J.-W., Koo, J.-M., Kim, J.-W., Ha, S.-S., Noh, B.-I., Lee, C.-Y., Park, J.-H., Shur, C.-C., Jung, S.-B.
Journal of Alloys and Compounds Vol.466 p.73 (2008)
http://www.sciencedirect.com/science/article/pii/S0925838807021263
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Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method
Yoon, J.-W., Chun, H.-S., Noh, B.-I., Koo, J.-M., Kim, J.-W., Lee, H.-J., Jung, S.-B.
Microelectronics Reliability Vol.48 p.1857 (2008)
http://www.sciencedirect.com/science/article/pii/S0026271408003740
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Effect of high-speed loading conditions on the fracture mode of the BGA solder joint
Kim, J.-W., Jang, J.-K., Ha, S.-O., Ha, S.-S., Kim, D.-G., Jung, S.-B.
Microelectronics Reliability Vol.48 p.1882 (2008)
http://www.sciencedirect.com/science/article/pii/S002627140800276X
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Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint
Yoon, J.-W., Noh, B.-I., Lee, Y.-H., Lee, H.-S., Jung, S.-B.
Microelectronics Reliability Vol.48 p.1864 (2008)
http://www.sciencedirect.com/science/article/pii/S0026271408002746
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A comparative evaluation of friction-welded and brazed Ti and AISI 321 stainless steel joints
Baek, S.-W., Lee, W.-B., Koo, J.-M., Lee, C.-Y., Jung, S.-B.
Materials Science Forum Vol.580-582 p.423 (2008)
http://www.scientific.net/MSF.580-582.423
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Characteristic of electrochemical migration on flexible printed circuit board
Noh, B.-I., Lee, J.-B., Lee, B.-Y., Jung, S.-B.
Materials Science Forum Vol.580-582 p.229 (2008)
http://www.scientific.net/MSF.580-582.229
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Thermal resistance control of an optical module packaging by a heat sink of high thermal conductivity
Oh, S.H., Kim, C.S., Rho, B.S., Jung, S.B., Jeong, M.Y.
Materials Science Forum Vol.580-582 p.163 (2008)
http://www.scientific.net/MSF.580-582.163
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Behaviour of electrochemical migration with solder alloys on printed circuit boards (PCBs)
Noh, B.-I., Jung, S.-B.
Circuit World Vol.34 p.8 (2008)
http://www.emeraldinsight.com/doi/abs/10.1108/03056120810918060
2007
01/
Texture evolution in Ni substrate prepared by powder metallurgy and casting methods
Lim, J.H., Kim, K.T., Park, E.C., Joo, J., Kim, H., Lee, H.-J., Jung, S.-B., Nah, W.
Materials Science Forum Vol.534-536 p.1605 (2007)
http://www.scientific.net/MSF.534-536.1605
02/
Grain growth behavior and mechanical properties of the friction stir welded zone of 7055 Al alloy followed by post weld heat treatment
Lee, W.-B., Lee, C.-Y., Yeon, Y.-M., Lee, J.-B., Chae, S.-C., Jung, S.-B.
Materials Science Forum Vol.539-543 p.4087 (2007)
http://www.scientific.net/MSF.539-543.4087
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Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging
Koo, J.-M., Jung, S.-B.
Microelectronics Reliability Vol.47 p.2169 (2007)
http://www.sciencedirect.com/science/article/pii/S0026271406003672
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Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint
Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Materials Science and Technology Vol.23 p.411 (2007)
http://www.tandfonline.com/doi/abs/10.1179/174328407X177009
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Characterisation of FR-4 substrate with various plasma treatment conditions
Noh, B.-I., Jung, S.-B.
Materials Science and Technology Vol.23 p.792 (2007)
http://www.tandfonline.com/doi/abs/10.1179/174328407X168874
06/
Mechanical strength of chip scale package with various underfills under accelerated thermal condition
Noh, B.-I., Lee, B.-Y., Jung, S.-B.
Materials Science and Technology Vol.23 p.828 (2007)
http://www.tandfonline.com/doi/abs/10.1179/174328407X192750
07/
Effect of DC bias voltage on the optical properties of TiO2 thin film deposited by plasma assisted electron beam evaporation
Hong, S.K., Jung, S.B., Kim, Y.C., Kee, W.K., Kang, C.S.
Materials Science Forum Vol.539-543 p.3557 (2007)
http://www.scientific.net/MSF.539-543.3557.pdf
08/
Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing
Kim, J.-W., Chun, H.-S., Ha, S.-S., Chae, J.-H., Joo, J., Shin, Y.-E., Jung, S.-B.
Advanced Materials Research Vol.15-17 p.633 (2007)
http://www.scientific.net/AMR.15-17.633
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Reliability of electroplated Sn-37Pb solder bumps with different under Bump Metallizations (UBMs) during high temperature storage test
Koo, J.-M., Kim, D.-G., Jung, S.-B.
Solid State Phenomena Vol.124-126 p.5 (2007)
http://www.scientific.net/SSP.124-126.5
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Interfacial reaction and bump shear property of electroplated Sn-37Pb solder bump with Ni under bump metallization during multiple reflows
Koo, J.-M., Jung, S.-B.
Advanced Materials Research Vol.15-17 p.181 (2007)
http://www.scientific.net/AMR.15-17.181
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Joint characteristics of spot friction stir welded 5052 Al alloy sheet
Lee, C.-Y., Lee, W.-B., Yeon, Y.-M., Song, K., Moon, J.-H., Kim, J.-G., Jung, S.-B.
Advanced Materials Research Vol.15-17 p.345 (2007)
http://www.scientific.net/AMR.15-17.345
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Interfacial reaction of Cu/Sn-Ag/ENIG sandwich solder joint during aging
Yoon, J.-W., Jung, S.-B.
Advanced Materials Research Vol.15-17 p.1001 (2007)
http://www.scientific.net/AMR.15-17.1001
13/
Effects of heat treatment and film thickness on microstructure and critical properties of YBCO film processed by TFA-MOD
Jang, S.H., Lim, J.H., Lee, J.S., Yoon, K.M., Kim, K.T., Joo, J., Jung, S.-B., Lee, H.-J.
Physica C: Superconductivity and its Applications Vol.451 p.118 (2007)
http://www.sciencedirect.com/science/article/pii/S092145340600815X
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Direct metallization of gold nanoparticles on a polystyrene bead surface using cationic gold ligands
Lee, J.-H., Kim, D.O., Song, G.-S., Lee, Y., Jung, S.-B., Nam, J.-D.
Macromolecular Rapid Communications Vol.28 p.634 (2007)
http://onlinelibrary.wiley.com/doi/10.1002/marc.200600757/full
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Microstructural evolution of Sn-rich Au-Sn/Ni flip-chip solder joints under high temperature storage testing conditions
Yoon, J.-W., Chun, H.-S., Koo, J.-M., Lee, H.-J., Jung, S.-B.
Scripta Materialia Vol.56 p.661 (2007)
http://www.sciencedirect.com/science/article/pii/S1359646207000140
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Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate
Noh, B.-I., Seok, C.-S., Moon, W.-C., Jung, S.-B.
International Journal of Adhesion and Adhesives Vol.27 p.200 (2007)
http://www.sciencedirect.com/science/article/pii/S0143749606000492
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Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process
Kim, J.-W., Jung, S.-B.
Materials Science and Engineering A Vol.452-453 p.267 (2007)
http://www.sciencedirect.com/science/article/pii/S092150930602329X
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Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging
Yoon, J.-W., Jung, S.-B.
Materials Science and Engineering A Vol.452-453 p.46 (2007)
http://www.sciencedirect.com/science/article/pii/S0921509306024373
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Investigation of interfacial reaction and joint reliability between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test
Yoon, J.-W., Chun, H.-S., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.18 p.559 (2007)
http://link.springer.com/article/10.1007/s10854-006-9085-4
20/
Characterization of failure behaviors in anisotropic conductive interconnection
Kim, J.-W., Kim, D.-G., Koo, J.-M., Yoon, J.-W., Choi, S., Kim, K.-S., Nam, J.-D., Lee, H.-J., Joo, J., Jung, S.-B.
Materials Transactions Vol.48 p.1070 (2007)
http://jlc.jst.go.jp/JST.JSTAGE/matertrans/48.1070?from=Google
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Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating
Yoon, J.-W., Chun, H.-S., Jung, S.-B.
Journal of Materials Research Vol.22 p.1219 (2007)
http://journals.cambridge.org/abstract_S0884291400095698
22/
Dynamic t-Tdyn-Tg diagram analysis of thermal isomerization of polyisoimide using complex electric modulus properties
Song, G.-S., Lee, J.-H., Jung, S.-B., Lee, Y., Choi, H.R., Koo, J.C., Kim, S.-W., Nam, J.-D.
Polymer Vol.48 p.3248 (2007)
http://www.sciencedirect.com/science/article/pii/S0032386107003230
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Design of solder joint structure for flip chip package with an optimized shear test method
Kim, J.-W., Jung, S.-B.
Journal of Electronic Materials Vol.36 p.690 (2007)
http://link.springer.com/article/10.1007/s11664-007-0140-6
24/
TEM study on the interfacial reaction between electroless plated Ni-P/Au UBM and Sn-3.5Ag solder
Park, M.-H., Kwon, E.-J., Kang, H.-B., Jung, S.-B., Yang, C.-W.
Metals and Materials International Vol.13 p.235 (2007)
http://link.springer.com/article/10.1007/BF03027811
25/
Fabrication of the YBCO films made by TFA-MOD using the 211-process
Lim, J.H., Jang, S.H., Kim, K.T., Lee, S.Y., Lee, C.M., Hwang, S.M., Joo, J., Jung, S.-B., Nah, W.-S.
IEEE Transactions on Applied Superconductivity Vol.17 p.3302 (2007)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4278178
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The effects of the humidity and thickness on YBCO film prepared using the TFA-MOD method
Jang, S.H., Lim, J.H., Yoon, K.M., Lee, S.Y., Kim, K.T., Park, E.C., Joo, J., Jung, S.-B., Kim, H.
IEEE Transactions on Applied Superconductivity Vol.17 p.3298 (2007)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4278142
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Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package
Koo, J.-M., Jung, S.-B.
Microsystem Technologies Vol.13 p.1567 (2007)
http://link.springer.com/article/10.1007/s00542-006-0344-3
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Au-Sn flip-chip solder bump for microelectronic and optoelectronic applications
Yoon, J.-W., Chun, H.-S., Koo, J.-M., Jung, S.-B.
Microsystem Technologies Vol.13 p.1463 (2007)
http://link.springer.com/article/10.1007/s00542-006-0330-9
29/
Solid-state interfacial reactions between Sn-3.5Ag-0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test
Chun, H.-S., Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.439 p.91 (2007)
http://www.sciencedirect.com/science/article/pii/S0925838806011078
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Morphology, thermal stability, and solderability of electroless nickel-phosphorus plating layer
Yoon, J.-W., Chun, H.-S., Kang, H.-B., Park, M.-H., Yang, C.-W., Lee, H.-J., Jung, S.-B.
Surface Review and Letters Vol.14 p.827 (2007)
http://www.worldscientific.com/doi/abs/10.1142/S0218625X07010111
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Surface modification of plasma treatment on SiO2 layer with underfill
Noh, B.-I., Jung, S.-B.
Surface Review and Letters Vol.14 p.849 (2007)
http://www.worldscientific.com/doi/pdf/10.1142/S0218625X07010160
32/
Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film
Kim, J.-W., Jung, S.-B.
Journal of Adhesion Science and Technology Vol.21 p.1071 (2007)
http://www.tandfonline.com/doi/abs/10.1163/156856107782105918
33/
Behavior of anisotropic conductive film joints bonded with various forces under temperature fluctuation
Kim, J.-W., Jung, S.-B.
Journal of Electronic Materials Vol.36 p.1199 (2007)
http://link.springer.com/article/10.1007/s11664-007-0191-8
34/
Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging
Yoon, J.-W., Chun, H.-S., Lee, H.-J., Jung, S.-B.
Journal of Materials Research Vol.22 p.2817 (2007)
http://journals.cambridge.org/abstract_S088429140002625X
35/
Characterizations of the mechanical properties and wear behavior of Ni plate fabricated by the electroforming process
Lee, S.Y., Jang, S.H., Lee, C.M., Choi, J.H., Joo, J., Lim, J.H., Jung, S.-B., Song, K.
Korean Journal of Materials Research Vol.17 p.538 (2007)
2007_v17n10_538 target=_blank>http://www.koreascience.or.kr/article/ArticleFullRecord.jsp?cn=GJRHBQ_2007_v17n10_538
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Fabrication of Ni metal mask by electroforming process using wetting agents
Lim, J.H., Park, E.C., Lee, S.Y., Yoon, J.-W., Ha, S.-S., Joo, J., Lee, H.-J., Jung, S.-B., Song, K.
Journal of Electronic Materials Vol.36 p.1510 (2007)
http://link.springer.com/article/10.1007/s11664-007-0211-8
37/
Investigation of interfacial reaction between Au-Sn solder and Kovar for hermetic sealing application
Yoon, J.-W., Jung, S.-B.
Microelectronic Engineering Vol.84 p.2634 (2007)
http://www.sciencedirect.com/science/article/pii/S0167931707005898
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Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
Ha, S.-S., Kim, D.-G., Kim, J.-W., Yoon, J.-W., Joo, J.-H., Shin, Y.-E., Jung, S.-B.
Microelectronic Engineering Vol.84 p.2640 (2007)
http://www.sciencedirect.com/science/article/pii/S0167931707005862
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Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate
Lee, C.-Y., Lee, J.-H., Choi, D.-H., Lee, H.-J., Kim, H.-S., Jung, S.-B., Moon, W.-C.
Microelectronic Engineering Vol.84 p.2653 (2007)
http://www.sciencedirect.com/science/article/pii/S0167931707005941
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Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus contents
Yoon, J.-W., Park, J.-H., Shur, C.-C., Jung, S.-B.
Microelectronic Engineering Vol.84 p.2552 (2007)http://www.sciencedirect.com/science/article/pii/S0167931707005916
41/
Reliability of nickel flip chip bumps with a tin-silver encapsulation on a copper/tin-silver substrate during the bonding process
Koo, J.-M., Kim, Y.-N., Yoon, J.-W., Ha, S.-S., Jung, S.-B.
Microelectronic Engineering Vol.84 p.2686 (2007)
http://www.sciencedirect.com/science/article/pii/S0167931707005928
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Reliability of adhesive interconnections for application in display module
Kim, J.-W., Lee, Y.-C., Kim, D.-G., Jung, S.-B.
Microelectronic Engineering Vol.84 p.2691 (2007)
http://www.sciencedirect.com/science/article/pii/S0167931707005874
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Reliability evaluation of underfill encapsulated Pb- free flip chip package under thermal shock test
Kim, D.-G., Kim, J.-W., Ha, S.-S., Koo, J.-M., Noh, B.-I., Jung, S.-B.
Materials Science Forum Vol.544-545 p.621 (2007)
http://www.scientific.net/MSF.544-545.621
2006
01/
Effects of number of reflows on the mechanical and electrical properties of BGA package
Noh, B.I., Koo, J.M., Kim, J.W., Kim, D.G., Nam, J.D., Joo, J., Jung, S.B.
Intermetallics Vol.14 p.1375 (2006)
http://www.sciencedirect.com/science/article/pii/S0966979506001269
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Reliability studies of Sn-9Zn/Cu solder joints with aging treatment
Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.407 p.141 (2006) http://www.sciencedirect.com/science/article/pii/S0925838805011345
03/
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application
Kim, J.-W., Kim, D.-G., Jung, S.-B.
Microelectronics Reliability Vol.46 p.535 (2006)
http://www.sciencedirect.com/science/article/pii/S0026271405001393
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Reexamination of the solder ball shear test for evaluation of the mechanical joint strength
Kim, J.-W., Jung, S.-B.
International Journal of Solids and Structures Vol.43 p.1928 (2006)
http://www.sciencedirect.com/science/article/pii/S0020768305004798
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Characteristic analysis of electroless Ni plating layer for electronic packaging
Kim, D.-G., Kim, J.-W., Yoon, J.-W., Lee, W.-B., Jung, S.-B.
Surface and Interface Analysis Vol.38 p.440 (2006)
http://onlinelibrary.wiley.com/doi/10.1002/sia.2291/full
06/
Interfacial reactions between In-48Sn solder and electroless nickel/immersion gold substrate during reflow process
Koo, J.-M., Yoon, J.-W., Jung, S.-B.
Surface and Interface Analysis Vol.38 p.426 (2006)
http://onlinelibrary.wiley.com/doi/10.1002/sia.2193/full
07/
Effect of isothermal aging on the interfacial reactions between Sn-0.4Cu solder and Cu substrate with or without ENIG plating layer
Yoon, J.-W., Jung, S.-B..
Surface and Coatings Technology Vol.200 p.4440 (2006)
http://www.sciencedirect.com/science/article/pii/S025789720500455X
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Development of textured Ni substrates prepared by powder metallurgy and casting
Lim, J.H., Kim, K.T., Joo, J., Kim, H., Jung, S.-B., Jeong, Y.-H., Kim, C.-J.
Physica C: Superconductivity and its Applications Vol.436 p.103 (2006)
http://www.sciencedirect.com/science/article/pii/S0921453406000815
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Effects of Cr3C2 on the microstructure and mechanical properties of the brazed joints between WC-Co and carbon steel
Lee, W.-B., Kwon, B.-D., Jung, S.-B.
International Journal of Refractory Metals and Hard Materials Vol.24 p.215 (2006)
http://www.sciencedirect.com/science/article/pii/S0263436805000399
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High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging
Yoon, J.-W., Jung, S.-B.
Microelectronics Reliability Vol.46 p.905 (2006)
http://www.sciencedirect.com/science/article/pii/S0026271405001034
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Investigations of the test parameters and bump structures in the shear test of flip chip solder bump
Kim, J.-W., Kim, D.-G., Jung, S.-B.
Thin Solid Films Vol.504 p.405 (2006)
http://www.sciencedirect.com/science/article/pii/S0040609005017311
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Evaluation of solder joint reliability in flip chip package under thermal shock test
Kim, D.-G., Kim, J.-W., Jung, S.-B.
Thin Solid Films Vol.504 p.426 (2006)
http://www.sciencedirect.com/science/article/pii/S0040609005017359
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Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn-Cu/Ni solder joint
Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.415 p.56 (2006)
http://www.sciencedirect.com/science/article/pii/S0925838805013150
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Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
Yoon, J.-W., Jung, S.-B.
Journal of Materials Research Vol.21 p.1590 (2006)
http://journals.cambridge.org/abstract_S0884291400083217
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Evaluation of joint resistance between Bi-2223/Ag superconducting tapes
Kim, J.H., Joo, J., Kim, H., Jung, S.B., Choi, S., Nah, W.
IEEE Transactions on Applied Superconductivity Vol.16 p.1059 (2006)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1643031
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Two different phases of a conducting polymer film formed by electrocasting method
Son, Y., Kim, J., Suh, S.-J., Jung, S.-B., Lee, Y.
Molecular Crystals and Liquid Crystals Vol.445 p.9 (2006)
http://www.tandfonline.com/doi/abs/10.1080/15421400500366662
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Interfacial reaction in steel-aluminum joints made by friction stir welding
Lee, W.-B., Schmuecker, M., Mercardo, U.A., Biallas, G., Jung, S.-B.
Scripta Materialia Vol.55 p.355 (2006)
http://www.sciencedirect.com/science/article/pii/S1359646206003356
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Microstructures and wear property of friction stir welded AZ91 Mg/SiC particle reinforced composite
Lee, W.-B., Lee, C.-Y., Kim, M.-K., Yoon, J.-I., Kim, Y.-J., Yoen, Y.-M., Jung, S.-B.
Composites Science and Technology Vol.66 p.1513 (2006)
http://www.sciencedirect.com/science/article/pii/S0266353805004562
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Fabrication of YBCO coated conductor by TFA-MOD using the "211 process"
Lim, J.H., Jang, S.H., Ha, H.-s., Lee, J.S., Yoon, K.M., Joo, J., Jung, S.-B., Kim, J.-G., Kim, H., Nah, W.
Physica C: Superconductivity and its Applications Vol.445-448 p.594 (2006)
http://www.sciencedirect.com/science/article/pii/S0921453406003832
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Reliability of flip chip package with underfills under thermal shock
Noh, B.-I., Jung, S.-B.
Key Engineering Materials Vol.321-323 p.1719 (2006)
http://www.scientific.net/KEM.321-323.1719
21/
Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging
Yoon, J.-W., Moon, W.-C., Jung, S.-B.
Microelectronic Engineering Vol.83 p.2329 (2006)
http://www.sciencedirect.com/science/article/pii/S0167931706005314
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Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection
Kim, J.-W., Moon, W.-C., Jung, S.-B.
Microelectronic Engineering Vol.83 p.2335 (2006)
http://www.sciencedirect.com/science/article/pii/S0167931706005326
23/
Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps
Kim, D.-G., Moon, W.-C., Jung, S.-B.
Microelectronic Engineering Vol.83 p.2391 (2006)
http://www.sciencedirect.com/science/article/pii/S0167931706005442
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Development of YBCO film approached by TFA-MOD method using the Y2Ba1Cu1Ox and Ba3Cu5O8 powders
Materials Research Society Vol.946 p.37 (2006)
http://journals.cambridge.org/abstract_S1946427400092174
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Mechanical properties of copper hollow sphere manufactured by sintering process
Koo, J.-M., Jung, S.-B.
Materials Science Forum Vol.510-511 p.730 (2006)
http://www.scientific.net/MSF.510-511.730
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Reliability of Sn-Ag-Cu flip chip package with underfill under thermal shock
Noh, B.-I., Jung, S.-B.
Materials Science Forum Vol.510-511 p.558 (2006)
http://www.scientific.net/MSF.510-511.558
27/
Effects of void formation within the Pb-free BGA solder balls on the mechanical joint strength
Kim, J.-W., Jung, S.-B.
Materials Science Forum Vol.510-511 p.546 (2006)
http://www.scientific.net/MSF.510-511.546
28/
Interfacial reaction and joint strength on Cu UBM with Pb-free flip chip solder bumps
Kim, D.-G., Ha, S.-S., Jung, S.-B.
Materials Science Forum Vol.510-511 p.55 (2006)
http://www.scientific.net/MSF.510-511.550
29/
Behavior of CaO and Calcium in pure Magnesium
HA, S.-H., LEE, J.-K., JO, H.-H., JUNG, S.-B., KIM Shae, K.
Rare Metals Vol.25 p.150 (2006)
http://www.sciencedirect.com/science/article/pii/S1001052108600716
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Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C
Yoon, J.-W., Lim, J.H., Lee, H.-J., Joo, J., Jung, S.-B., Moon, W.-C.
Journal of Materials Research Vol.21 p.3196 (2006)
http://journals.cambridge.org/abstract_S0884291400082145
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Surface modification of plasma treatment on SiO2 layer with underfill
Noh, B.-I., Jung, S.-B.
Surface Review and Letters Vol.14 p.849 (2007)
http://www.worldscientific.com/doi/pdf/10.1142/S0218625X07010160
2005
01/
Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate
Kim, D.-G., Jung, S.-B.
Journal of Alloys and Compounds Vol.386 p.151 (2005)
http://www.sciencedirect.com/science/article/pii/S0925838804007716
02/
Induction brazing of γ-TiAl to alloy steel AISI 4140 using filler metal of eutectic Ag-Cu alloy coated with Ti film
Koo, J.-M., Lee, W.-B., Kim, M.-G., Kim, D.-U., Kim, Y.-J., Jung, S.-B.
Materials Transactions Vol.46 p.303 (2005)
http://jlc.jst.go.jp/DN/JALC/00247782653?from=Google
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Correlation between displacement rate and shear force in shear test of Sn-Pb and lead
Kim, J.-W., Joo, J., Quesnel, D.J., Jung, S.-B.
Materials Science and Technology Vol.21 p.373 (2005)
http://www.tandfonline.com/doi/abs/10.1179/174328405X29258
04/
Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate
Kim, D.-G., Jang, H.-S., Jung, S.-B.
Materials Science and Technology Vol.21 p.381 (2005)
http://www.tandfonline.com/doi/abs/10.1179/174328405X27061
05/
Effects of intermetallic compound on the electrical and mechanical properties of friction
Lee, W.-B., Bang, K.-S., Jung, S.-B.
Journal of Alloys and Compounds Vol.390 p.212 (2005)
http://www.sciencedirect.com/science/article/pii/S0925838804010977
06/
Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints
Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.391 p.82 (2005)
http://www.sciencedirect.com/science/article/pii/S0925838804011284
07/
IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate
Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.392 p.247 (2005)
http://www.sciencedirect.com/science/article/pii/S0925838804012356
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Characterization of the shear test method with low melting point In-48Sn solder joints
Kim, J.-W., Jung, S.-B.
Materials Science and Engineering A Vol. 397 p.145 (2005)
http://www.sciencedirect.com/science/article/pii/S0921509305001772
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The joint characteristics of friction stir welded Mg-Zn-Y alloy
Lee, C.-Y., Lee, W.-B., Yeon, Y.-M., Jung, S.-B.
Materials Science Forum Vol.475-479 p.555 (2005)
http://www.scientific.net/MSF.475-479.555
10/
Solid state interfacial reaction and joint strength of Sn-37Pb solder with Ni-P under bump metallization in flip chip application
Kim, D.-G., Kim, J.-W., Lee, J.-G., Mori, H., Quesnel, D.J., Jung, S.-B.
Journal of Alloys and Compounds Vol.395 p.80 (2005)
http://www.sciencedirect.com/science/article/pii/S0925838804015014
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Intermetallic compound formation and growth kinetics in flip chip joints using Sn-3.0Ag-0.5Cu solder and Ni-P under bump metallurgy
Kim, D.-G., Jung, S.-B.
Materials Transactions Vol.46 p.1295 (2005)
http://jlc.jst.go.jp/DN/JALC/00256823293?from=Google
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Interfacial reactions between Sn-0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction
Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.396 p.122 (2005)
http://www.sciencedirect.com/science/article/pii/S0925838804015518
13/
Effects of the local microstructures on the mechanical properties in FSWed joints of a 7075-T6 Al alloy
Lee, W.-B., Lee, C.-Y., Yeon, Y.-M., Jung, S.-B.
Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques Vol.96 p.940 (2005)
http://www.hanser-elibrary.com/doi/abs/10.3139/146.101123
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Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM
Kim, D.-G., Kim, J.-W., Jung, S.-B.
Materials Science and Engineering B: Solid-State Materials for Advanced Technology Vol.121 p.204 (2005)
http://www.sciencedirect.com/science/article/pii/S0921510705002540
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Correlation between the interfacial reaction and mechanical joint strength of the flip chip
Kim, D.-G., Jang, H.-S., Kim, J.-W., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.16 p.603 (2005)
http://link.springer.com/article/10.1007/s10854-005-3234-z
16/
Fabrication of YBCO coated conductor by TFA-MOD method in route of dissolving Y211 and Ba3Cu5O8 powders in TFA
Lim, J.H., Jang, S.H., Kim, J.H., Kim, K.T., Joo, J., Jung, S.-B., Kim, J.-G., Lee, H.G., Hong, G.W.
Physica C: Superconductivity and its Applications Vol.426-431 p.973 (2005)
http://www.sciencedirect.com/science/article/pii/S0921453405003953
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Microstructural investigation of friction stir welded pure titanium
Lee, W.-B., Lee, C.-Y., Chang, W.-S., Yeon, Y.-M., Jung, S.-B.
Materials Letters Vol.59 p.3315 (2005)
http://www.sciencedirect.com/science/article/pii/S0167577X05005495
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Microstructure and mechanical properties of Sn-0.7 Cu flip chip solder bumps using stencil printing method
Kim, D.-G., Jung, S.-B.
Materials Transactions Vol.46 p.2366 (2005)
http://jlc.jst.go.jp/DN/JALC/00260991285?from=Google
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Interfacial reaction and mechanical characterization of eutectic Sn-Zn/ ENIG solder joints
Yoon, J.-W., Chun, H.-S., Jung, S.-B.
Materials Transactions Vol.46 p.2386 (2005)
http://jlc.jst.go.jp/DN/JALC/00260991322?from=Google
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Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation
Kim, J.-W., Jung, S.-B.
Microelectronic Engineering Vol.82 p.554 (2005)
http://www.sciencedirect.com/science/article/pii/S0167931705003941
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Reliability evaluations of flip chip package under thermal shock test
Kim, D.-G., Kim, J.-W., Jung, S.-B.
Microelectronic Engineering Vol.82 p.575 (2005)
http://www.sciencedirect.com/science/article/pii/S0167931705003977
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Investigations of interfacial reaction and shear strength between Pb-free flip chip solder and electroplated Cu UBM
Kim, D.G., Jang, H.S., Kim, J.W., Jung, S.B.
Key Engineering Materials Vol.297-300 p.863 (2005)
http://www.scientific.net/KEM.297-300.863
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Effect of substrate metallization on mechanical properties of Sn-3.5Ag BGA solder joints with multiple reflows
Koo, J.-M., Jung, S.-B.
Microelectronic Engineering Vol.82 p.569 (2005)
http://www.sciencedirect.com/science/article/pii/S0167931705003965
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Mechanical and electrical properties of Sn-3.5 Ag Solder/Cu BGA packages during multiple reflows
Koo, J.M., Lee, Y.H., Kim, S.K., Jeong, M.Y., Jung, S.B.
Key Engineering Materials Vol.297-300 p.801 (2005)
http://www.scientific.net/KEM.297-300.801
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Analysis of the test parameters in the shear test of BGA solder joints
Kim, J.W., Park, S.K., Jung, S.B.
Key Engineering Materials Vol.297-300 p.851 (2005)
http://www.scientific.net/KEM.297-300.851
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Interfacial reaction and shear strength of Pb-free Sn-3.5 Ag/Ni BGA solder joints during reflow
Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Materials Science Forum Vol.486-487 p.289 (2005)
http://www.scientific.net/MSF.486-487.289
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Optimum shear height for evaluation of Pb-free solder ball shear strength
Kim, J.-W., Park, S.-K., Jung, S.-B.
Materials Science Forum Vol.486-487 p.269 (2005)
http://www.scientific.net/MSF.486-487.269
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Reliability of in-48Sn solder/Au/Ni/Cu BGA packages during reflow process
Koo, J.A.-M., Jung, S.-B.
Journal of Electronic Materials Vol.34 p.1565 (2005)
http://link.springer.com/article/10.1007/s11664-005-0166-6
29/
Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni joints with reflow
Yoon, J.-W., Jung, S.-B.
Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques Vol.96 p.1420 (2005)
http://www.hanser-elibrary.com/doi/abs/10.3139/146.101194
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Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu
Lee, C.-Y., Yoon, J.-W., Kim, Y.-J., Jung, S.-B.
Microelectronic Engineering Vol.82 p.561 (2005)
http://www.sciencedirect.com/science/article/pii/S0167931705003953
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Evaluation of solder joint reliability in flip-chip packages during accelerated testing
Kim, J.-W., Kim, D.-G., Hong, W.S., Jung, S.-B.
Journal of Electronic Materials Vol.34 p.1550 (2005)
http://link.springer.com/article/10.1007/s11664-005-0164-8
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Growth kinetics of intermetallic compound and interfacial reactions in Pb-free flip chip
Kim, D.-G., Jang, H.-S., Kim, Y.-J., Jung, S.-B.
Materials Science Forum Vol.486-487 p.273 (2005)
http://www.scientific.net/MSF.486-487.273
33/
Friction stir welding of dissimilar formed Mg alloys (AZ31/AZ91)
Lee, C.-Y., Lee, W.-B., Yeon, Y.-M., Jung, S.-B.
Materials Science Forum Vol.486-487 p.249 (2005)
http://www.scientific.net/MSF.486-487.249
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Mechanical strength test method for solder ball joint in BGA package
Kim, J.-W., Kim, D.-G., Jung, S.-B.
Metals and Materials International Vol.11 p.121 (2005)
http://link.springer.com/article/10.1007/BF03027455
2004
01/
Friction welding of TiAl and AlSl4140
Lee, W.-B., Kim, M.-G., Koo, J.-M., Kim, K.-K., Quesnel, D.J., Kim, Y.-J., Jung, S.-B.
Journal of Materials Science Vol.39 p.1125 (2004)
http://www.springerlink.com/index/U7636141Q6R854P6.pdf
02/
The joint properties of copper by friction stir welding
Lee, W.-B., Jung, S.-B.
Materials Letters Vol.58 p.1041 (2004)
http://www.sciencedirect.com/science/article/pii/S0167577X03006736
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Interfacial reactions and intermetallic compound growth between indium and copper
Kim, D.-G., Lee, C.-Y., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.15 p.95 (2004)
http://link.springer.com/article/10.1023/B:JMSE.0000005383.95823.13
04/
IMC growth and shear strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA joints during aging
Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Materials Transactions Vol.45 p.727 (2004)
http://jlc.jst.go.jp/DN/JALC/00238678804?from=Google
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Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints
Kim, J.-W., Jung, S.-B.
Materials Science and Engineering A Vol.371 p.267 (2004)
http://www.sciencedirect.com/science/article/pii/S0921509303014801
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Mechanical properties related to microstructural variation of 6061 Al alloy joints by friction stir welding
Lee, W.-B., Yeon, Y.-M., Jung, S.-B.
Materials Transactions Vol.45 p.1700 (2004)
http://jlc.jst.go.jp/DN/JALC/00240360605?from=Google
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Void free friction stir weld zone of the dissimilar 6061 aluminum and copper joint by shifting the tool insertion location
Lee, W.-B., Jung, S.-B.
Materials Research Innovations Vol.8 p.93 (2004)
http://cat.inist.fr/?aModele=afficheN&cpsidt=15860726
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Effects of copper insert layer on the properties of friction welded joints between TiAl and AISI 4140 structural steel
Lee, W.-B., Kim, Y.-J., Jung, S.-B.
Intermetallics Vol.12 p.671 (2004)
http://www.sciencedirect.com/science/article/pii/S0966979504000457
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Effect of isothermal aging on intermetallic compound layer growth at the interface
Yoon, J.-W., Jung, S.-B.
Journal of Materials Science Vol.39 p.4211 (2004)
http://link.springer.com/article/10.1023/B:JMSC.0000033401.38785.73
10/
Growth kinetics of IMC formed between Sn-3.5Ag-0.75Cu BGA solder and electroless Ni-P/Cu substrate by solid-state isothermal aging
Yoon, J.-W., Lee, C.-B., Jung, S.-B.
Materials Science Forum Vol.449-452 p.893 (2004)
http://www.scientific.net/MSF.449-452.893
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Influence of shear speed on the shear force of eutectic Sn-Pb and Pb-free BGA solder joints
Kim, J.-W., Yoon, J.-W., Jung, S.-B.
Materials Science Forum Vol.449-452 p.897 (2004)
http://www.scientific.net/MSF.449-452.897
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Effect of PWHT on behaviors of precipitates and hardness distribution of 6061 Al alloy
Lee, W.-B., Jang, H.-S., Yeon, Y.-M., Jung, S.-B.
Materials Science Forum Vol.449-452 p.601 (2004)
http://www.scientific.net/MSF.449-452.601
13/
A study on interfacial reaction between electroless plated Ni-P/Au UBM and Sn-Bi eutectic solder using AEM
Choi, J.K., Kang, H.B., Lee, J.W., Jung, S.B., Yang, C.W.
Materials Science Forum Vol.449-452 p.405 (2004)
http://www.scientific.net/MSF.449-452.405
14/
Phase analysis and kinetics of solid-state ageing of Pb-free Sn-3.5Ag solder on electroless Ni-P substrate
Yoon, J.-W., Jung, S.-B.
Surface and Interface Analysis Vol.36 p.963 (2004)
http://onlinelibrary.wiley.com/doi/10.1002/sia.1812/full
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Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P
Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.376 p.105 (2004)
http://www.sciencedirect.com/science/article/pii/S0925838804000064
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Effect of microstructure on mechanical properties of friction-welded joints between Ti and AISI 321 stainless steel
Lee, W.-B., Jung, S.-B.
Materials Transactions Vol.45 p.2805 (2004)
http://jlc.jst.go.jp/JST.JSTAGE/matertrans/45.2805?from=Google
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Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization
Kim, S.-W., Yoon, J.-W., Jung, S.-B.
Journal of Electronic Materials Vol.33 p.1182 (2004)
http://link.springer.com/article/10.1007/s11664-004-0122-x
18/
Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
Yoon, J.-W., Kim, S.-W., Koo, J.A.-M., Kim, D.-G., Jung, S.-B.
Journal of Electronic Materials Vol. 33 p.1190 (2004)
http://link.springer.com/article/10.1007/s11664-004-0122-x
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Effect of bonding time on joint properties of vacuum brazed WC-Co hard metal/carbon steel using stacked Cu and Ni alloy as insert metal
Lee, W.-B., Kwon, B.-D., Jung, S.-B.
Materials Science and Technology Vol.20 p.151 (2004)
http://www.tandfonline.com/doi/abs/10.1179/026708304X4312
20/
Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu
Yoon, J.-W., Lee, Y.-H., Kim, D.-G., Kang, H.-B., Suh, S.-J., Yang, C.-W., Lee, C.-B., Jung, J.-M., Yoo, C.-S., Jung, S.-B.
Journal of Alloys and Compounds Vol.381 p.1561 (2004)
http://www.sciencedirect.com/science/article/pii/S0925838804003895
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The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-Plated Cu substrate
Kim, D.-G., Jung, S.-B.
Journal of Electronic Materials Vol.33 p.1561 (2004)
http://link.springer.com/article/10.1007/s11664-004-0099-5
22/
Effect of reflow time on interfacial reaction and shear strength of Sn-0.7Cu solder/Cu and electroless Ni-P BGA joints
Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.385 p.192 (2004)
http://www.sciencedirect.com/science/article/pii/S0925838804006954
2003
01/
Reaction diffusion and formation of Cu11In9 and In27Ni10 phases in the couple of indium-substrates
Kim, D.-G., Yoon, J.-W., Lee, C.-Y., Jung, S.-B.
Materials Transactions Vol.44 p.72 (2003)
http://jlc.jst.go.jp/DN/JALC/00164386446?from=Google
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Mechanical properties of copper to titanium joined by friction welding
Kim, S.-Y., Jung, S.-B., Shur, C.-C., Yeon, Y.-M., Kim, D.-U.
Journal of Materials Science Vol.38 p.1281 (2003)
http://link.springer.com/article/10.1023/A:1022890611264
03/
Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, electroless Ni-P/Cu) substrate
Yoon, J.-W., Lee, C.-Y., Lee, C.-B., Yoo, C.-S., Jung, S.-B.
Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques Vol.94 p.453 (2003)
http://www.hanser-elibrary.com/doi/abs/10.3139/146.030453
04/
Reaction Diffusions of Cu6Sn5 and Cu3Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Yoon, J.-W., Lee, C.-B., Kim, D.-U., Jung, S.-B.
Metals and Materials International Vol.9 p.193 (2003)
http://link.springer.com/article/10.1007/BF03027277
05/
The joint characteristics of friction stir welded AZ91D magnesium alloy
Lee, W.-B., Kim, J.-W., Yeon, Y.-M., Jung, S.-B.
Materials Transactions Vol.44 p.917 (2003)
http://jlc.jst.go.jp/DN/JALC/00221979352?from=Google
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Joint properties of friction stir welded AZ31B - H24 magnesium alloy
Lee, W.B., Yeon, Y.M., Jung, S.B.
Materials Science and Technology Vol.19 p.785 (2003)
http://www.tandfonline.com/doi/abs/10.1179/026708303225001867
07/
Effect of friction welding parameters on mechanical and metallurgical properties of aluminium alloy 5052 - A36 steel joint
Lee, W.B., Yeon, Y.M., Kim, D.U., Jung, S.B.
Materials Science and Technology Vol.19 p.773 (2003)
http://www.tandfonline.com/doi/abs/10.1179/026708303225001876
08/
Joint properties and thermal behaviors of friction stir welded age hardenable 6061Al alloy
Chang, W.-S., Bang, H.-S., Jung, S.-B., Yeon, Y.-M., Kim, H.-J., Lee, W.-B.
Materials Science Forum Vol.426-432 p.2953 (2003)
http://www.scientific.net/MSF.426-432.2953.pdf
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Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag
Yoon, J.-W., Lee, C.-B., Jung, S.-B.
Materials Science and Technology Vol.19 p.1101 (2003)
http://www.tandfonline.com/doi/abs/10.1179/026708303225003063
10/
Intermetallic compound layer formation between Sn-3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni-P/Cu) substrate
Lee, C.-B., Yoon, J.-W., Suh, S.-J., Jung, S.-B., Yang, C.-W., Shur, C.-C., Shin, Y.-E.
Journal of Materials Science: Materials in Electronics Vol.14 p.487 (2003)
http://link.springer.com/article/10.1023/A:1023968800400
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The improvement of mechanical properties of friction-stir-welded A356 Al alloy
Lee, W.B., Yeon, Y.M., Jung, S.B.
Materials Science and Engineering A Vol.355 p.154 (2003)
http://www.sciencedirect.com/science/article/pii/S0921509303000534
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The joint properties of dissimilar formed Al alloys by friction stir welding according to the fixed location of materials
Lee, W.-B., Yeon, Y.-M., Jung, S.-B.
Scripta Materialia Vol.49 p.423 (2003)
http://www.sciencedirect.com/science/article/pii/S1359646203003014
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Investigation of interfacial reactions between Sn-5Bi solder and Cu substrate
Yoon, J.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol. 359 p.202 (2003)
http://www.sciencedirect.com/science/article/pii/S0925838803002913
14/
The mechanical properties related to the dominant microstructure in the weld zone of dissimilar formed Al alloy joints by friction stir weldingDownload :
Lee, W.B., Yeon, Y.M., Jung, S.B.
Journal of Materials Science Vol.38 p.4183 (2003)
http://link.springer.com/article/10.1023/A:1026337807920
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Evaluation of the microstructure and mechanical properties of friction stir welded 6005 aluminum alloy
Lee, W.B., Yeon, Y.M., Jung, S.B.
Materials Science and Technology Vol.19 p.1513 (2003)
http://www.tandfonline.com/doi/abs/10.1179/026708303225008068
16/
Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
Yoon, J.-W., Lee, C.-B., Jung, S.-B.
Journal of Electronic Materials Vol.32 p.1195 (2003)
http://link.springer.com/article/10.1007/s11664-003-0011-8
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Effect of Isothermal Aging on the Intermetallic Compound Layer Growth in BGA Joints
Yoon, J.-W., Lee, C.-B., Quesnel, D.J., Jung, S.-B.
The International Society for Optical Engineering Vol.52 p.465 (2003)
http://cat.inist.fr/?aModele=afficheN&cpsidt=15876606
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The characterization of electroless ni bump for the flip chip
Lee, C.Y., Lee, C.B., Jung, S.-B., Shur, C.-C.
Journal of Metastable and Nanocrystalline Materials Vol.15-16 p.439 (2003)
http://www.scientific.net/JMNM.15-16.439.pdf
19/
Effect of microstructural variation on the Cu/CK45 carbon steel friction weld joint
Lee, W.B., Jung, S.B.
Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques Vol.94 p.1300 (2003)
http://www.hanser-elibrary.com/doi/abs/10.3139/146.031300
20/
Effects of fine fiber structures on the mechanical and electrical properties of cold rolled Cu-Ag sheet
Lee, W.-B., Yoon, E.-H., Jung, S.-B.
Journal of Materials Science Letters Vol.22 p.1751 (2003)
http://www.springerlink.com/index/N5136727623U3523.pdf
2002
01/
Assessment of investment process for producing copper hollow spheres
Jung, S.-B., Kim, S.K., Kim, Y.-J.
Materials Transactions Vol.43 p.85 (2002)
http://jlc.jst.go.jp/DN/JALC/00155021264?from=Google
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Effect of surface finishes on ball shear strength in BGA joints with Sn-3.5 mass% Ag solder
Lee, C.-B., Lee, I.-Y., Jung, S.-B., Shur, C.-C.
Materials Transactions Vol.43 p.751 (2002)
http://jlc.jst.go.jp/DN/JALC/00156848921?from=Google
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A study on μBGA solder joints reliability using lead-free solder materials
Shin, Y.-E., Lee, J.-H., Koh, Y.-W., Lee, C.-W., Yun, J.-H., Jung, S.-B.
KSME International Journal Vol.16 p.919 (2002)
http://link.springer.com/article/10.1007/BF02949720
04/
Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5Ag-0.75Cu
Lee, C.-B., Jung, S.-B., Shin, Y.-E., Shur, C.-C.
Materials Transactions Vol.43 p.1858 (2002)
http://jlc.jst.go.jp/DN/JALC/00158833420?from=Google
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Interfacial reactions between Sn-58 mass% Bi eutectic solder and (Cu, electroless Ni-P/Cu) substrate
Yoon, J.-W., Lee, C.-B., Jung, S.-B.
Interfacial reactions between Sn-58 mass% Bi eutectic solder and (Cu, electroless Ni-P/Cu) substrate
Materials Transactions Vol.43 p.1821 (2002)
http://jlc.jst.go.jp/JST.JSTAGE/matertrans/43.1821?from=Google
2001
01/
Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis
Shin, Y.-E., Lee, K.-W., Chang, K.-H., Jung, S.-B., Jung, J.P.
Materials Transactions Vol.42 p.809 (2001)
http://jlc.jst.go.jp/DN/JALC/00075258528?from=Google
02/
Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization
Park, J.Y., Yang, C.W., Ha, J.S., Kim, C.-U., Kwon, E.J., Jung, S.B., Kang, C.S.
Journal of Electronic Materials Vol.30 p.1165 (2001)
http://link.springer.com/article/10.1007/s11664-001-0145-5
03/
The effect of Bi concentration on wettability of Cu substrate by Sn-Bi solders
Lee, C.-B., Jung, S.-B., Shin, Y.-E., Shur, C.-C.
Materials Transactions Vol.42 p.751 (2001)
http://jlc.jst.go.jp/JST.JSTAGE/matertrans/42.751?from=Google
04/
Characterization of the thermal conductivity and mechanical properties of sheath alloy materials for Bi-2223 superconductor tapes
Park, H.S., Ji, B.K., Lim, J.H., Joo, J., Jung, S.-B., Nah, W., Yoo, J., Ko, J., Kim, H.
IEEE Transactions on Applied Superconductivity Vol.11 p.3277 (2001)
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=919762
05/
Dealloying behavior of unleaded brasses containing bismuth in potable water
Kim, J.-G., Jung, S.-B., Kwon, O.-H.
Corrosion Vol.57 p.291 (2001)
http://www.corrosionjournal.org/doi/abs/10.5006/1.3290351
1999
01/
Diffusion of manganese in Ni and Ni3Al
Jung, S.B., Minamino, Y., Yamane, T.
Journal of Materials Science Letters Vol.18 p.1063 (1999)
http://www.springerlink.com/index/U881785J3G483838.pdf
02/
Effects of silver additions on the mechanical properties and resistance to thermal shock of YBa2Cu3O7-δ superconductors
Joo, J., Jung, S.-B., Nah, W., Kim, J.-Y., Sung Kim, T.
Cryogenics Vol.39 p.107 (1999)
http://www.sciencedirect.com/science/article/pii/S0011227599000259
03/
Al composition dependence of Pt, Mn and V diffusion in L12-type ordered Ni3Al
Minamino, Y., Yoshida, H., Hirao, K., Yamane, T., Jung, S.B.
High Temperature Materials and Processes Vol.18 p.337 (1999)
1999.18.5-6/htmp.1999.18.5-6.337/htmp.1999.18.5-6.337.xml target=_blank>http://www.degruyter.com/view/j/htmp.1999.18.5-6/htmp.1999.18.5-6.337/htmp.1999.18.5-6.337.xml
1992 - 1997
01/
Diffusion of platinum and molybdenum in Ni and Ni3Al
Minamino, Y., Yoshida, H., Jung, S.B., Hirao, K., Yamane, T.
Defect and Diffusion Forum Vol.143-147 p.257 (1997)
http://www.scientific.net/DDF.143-147.257.pdf
02/
Improvement of scanning accuracy of PZT piezoelectric actuators by feed-forward model-reference control
Jung, S.-B., Kim, S.-W.
Precision Engineering Vol.16, p49 (1994)
http://www.sciencedirect.com/science/article/pii/0141635994900183
03/
Anomalous diffusion of Aluminum in β-Titanium
Araki, H., Yamane, T., Minamino, Y., Saji, S., Hana, Y., Jung, S.b.
Metallurgical and Materials Transactions A, Vol.25, p874 (1994)
http://scholar.google.co.kr/scholar?q=Anomalous+diffusion+of+Aluminum+in+%CE%B2-Titanium+Metallurgical+and+Materials+Transactions&btnG=&hl=ko&as_sdt=0%2C5
04/
Activation volumes for diffusion of Cu, Fe and Si in Ni
Jung, S.B., Yamane, T., Minamino, Y., Araki, H., Saji, S., Tojkowski, W., Miyamoto, Y.
Journal of Materials Science Letters Vol.12, p.1057 (1993)
http://link.springer.com/article/10.1007%2FBF00420218?LI=true
05/
Activation volumes in diffusion of copper, iron and silicon in Ni3Al intermetallic phase
Jung, S.B., Yamane, T., Minamino, Y., Araki, H., Saji, S., Hirao, K., Miyamoto, Y.
Journal of Materials Science Letters Vol.12 p.1294 (1993)
http://link.springer.com/article/10.1007%2FBF00506342?LI=true
06/
Reaction diffusion and formation of Al3Ni and Al3Ni2 phases in the Al-Ni system
Jung, S.B., Minamino, Y., Yamane, T., Saji, S.
Journal of Materials Science Letters Vol.12 p.1684 (1993)
http://link.springer.com/article/10.1007%2FBF00418831?LI=true
07/
Interdiffusion and its size effect in nickel solid solutions of Ni-Co, Ni-Cr and Ni-Ti systems
Jung, S.B., Yamane, T., Minamino, Y., Hirao, K., Araki, H., Saji, S.
Journal of Materials Science Letters Vol.11 p.1333 (1992)
http://link.springer.com/article/10.1007%2FBF00729354?LI=true
08/
Diffusion of cobalt, chromium, and titanium in Ni3Al
Diffusion of cobalt, chromium, and titanium in Ni3Al
Metallurgical Transactions A Vol.23 p.2783 (1992)
http://link.springer.com/article/10.1007/BF02651757