Micro System Packaging Laboratory (MSPL)
2021
08/
JH Jang, KD Min, CJ Lee, BU Hwang, SB Jung
Journal of Electronic Materials, 50, 5639–5646
https://link.springer.com/article/10.1007/s11664-021-09102-4
07/
KD Min, CJ Lee, BU Hwang, JH Kim, JH Jang, SB Jung
Applied Surface Science 551, 149396
https://www.sciencedirect.com/science/article/pii/S0169433221004724
06/
CJ Lee, DG Kang, BU Hwang, KD Min, J Joo, SB Jung
Journal of Alloys and Compounds 863, 158726
05/
Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi
KD Min, KH Jung, CJ Lee, BU Hwang, SB Jung
Journal of Alloys and Compounds 857, 157595
https://www.sciencedirect.com/science/article/pii/S0925838820339591
04/
Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)
JH Kim, CJ Lee, KD Min, BU Hwang, DG Kang, DH Choi, J Joo, SB Jung
Composite Structures 258, 113364
https://www.sciencedirect.com/science/article/pii/S0263822320332906
03/
Design and analysis of Cu circuit for stretchable electronic circuits using finite element analysis
KY Kim, CJ Lee, SB Jung
Microelectronic Engineering, 111510
https://www.sciencedirect.com/science/article/pii/S0167931721000125
02/
Effect of Ni (P) thickness in Au/Pd/Ni (P) surface finish on the electrical reliability of Sn–3.0 Ag–0.5 Cu solder joints during current-stressing
J Kim, SB Jung, JW Yoon
Journal of Alloys and Compounds 850, 156729
https://www.sciencedirect.com/science/article/pii/S0925838820330930
01/
G Jeong, DY Yu, S Baek, J Bang, TI Lee, SB Jung, JS Kim, YH Ko
Materials 14 (2), 335
2020
33/
HS Joo, CJ Lee, KD Min, BU Hwang, SB Jung
Journal of Materials Science: Materials in Electronics 31 (24), 22926-22932
https://link.springer.com/article/10.1007/s10854-020-04819-0
32/
The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature
CJ Lee, KD Min, H Jeong, BU Hwang, SB Jung
Journal of Electronic Materials 49 (11), 6746-6753
https://link.springer.com/article/10.1007/s11664-020-08426-x
31/
Electromigration behavior of Cu core solder joints under high current density
H Jeong, CJ Lee, JH Kim, J Son, SB Jung
ELECTRONIC MATERIALS LETTERS 16 (6), 513-519
https://link.springer.com/article/10.1007/s13391-020-00239-8
30/
Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi
KD Min, KH Jung, CJ Lee, BU Hwang, SB Jung
Journal of Alloys and Compounds, 157595
https://www.sciencedirect.com/science/article/pii/S0925838820339591
29/
Bending reliability of Ni–MWCNT composite solder with a differential structure
CJ Lee, BU Hwang, KD Min, JH Kim, SB Jung
Microelectronics Reliability 113, 113934
https://www.sciencedirect.com/science/article/pii/S0026271420307654
28/
Mechanical properties of Cu-core solder balls with ENEPIG surface finish
H Jeong, CJ Lee, KD Min, J Son, SB Jung
Journal of Electronic Materials 49 (10), 6073-6079
https://link.springer.com/article/10.1007/s11664-020-08338-w
27/
Effects of Ni (P) layer thickness and Pd layer type in thin-Au/Pd/Ni (P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging
J Kim, SB Jung, JW Yoon
Journal of Materials Science: Materials in Electronics, 1-23
https://link.springer.com/article/10.1007/s10854-020-04509-x
26/
Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test
H Jeong, KD Min, CJ Lee, JH Kim, SB Jung
Microelectronics Reliability 112, 113918
https://www.sciencedirect.com/science/article/pii/S0026271420307496
25/
Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications
SE Jeong, SB Jung, JW Yoon
Journal of Materials Science: Materials in Electronics 31 (18), 15048-15060
https://link.springer.com/article/10.1007/s10854-020-04068-1
24/
Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test
BU Hwang, KD Min, CJ Lee, JH Kim, SB Jung
Materialia 12, 100808
https://www.sciencedirect.com/science/article/pii/S2589152920302246
23/
Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding
KD Min, KH Jung, CJ Lee, H Jeong, BU Hwang, SB Jung
ELECTRONIC MATERIALS LETTERS 16, 347–354
https://link.springer.com/article/10.1007%2Fs13391-020-00221-4
22/
Ultra‐Fast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy
KH Jung, K Deuk Min, CJ Lee, H Jeong, JH Kim, SB Jung
Advanced Engineering Materials 22, 2000179
https://onlinelibrary.wiley.com/doi/full/10.1002/adem.202000179
21/
Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package
CJ Lee, WR Myung, BG Park, SB Jung
Journal of Materials Science: Materials in Electronics, 1-7
https://link.springer.com/article/10.1007%2Fs10854-020-03562-w
20/
Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross‑Linking Process
CJ Lee, BU Hwang, H Jeong, KD Min, SB Jung
ELECTRONIC MATERIALS LETTERS 16, 332–339
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00012
19/
Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering
CJ Lee, KH Jung, KD Min, BG Park, SB Jung
Journal of Materials Science & Technology Vol. 53, 15
https://www.sciencedirect.com/science/article/pii/S100503022030339X
18/
Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint
J Kim, SB Jung, JW Yoon
Journal of Alloys and Compounds 820, 153396
https://www.sciencedirect.com/science/article/pii/S0925838819346420
17/
Mechanical properties of Sn-58 wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests
CJ Lee, KD Min, HJ Park, SB Jung
Journal of Alloys and Compounds 820, 153077
https://www.sciencedirect.com/science/article/pii/S0925838819343233
16/
Mechanical Properties and Microstructure of Cu Core Solder Ball (CCSB) Compared with SAC305 Solder for 2.5D and 3D Structure Package (PKG)
JY Son, H Jeong, S Lee, Y Lee, SB Jung
Science of Advanced Materials 12 (4), 556-563
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00016
15/
Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish
H Jeong, WR Myung, KY Kim, KD Min, SB Jung
Science of Advanced Materials 12 (4), 525-530
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00011
14/
Effects of Silane Coupling Agents on the Adhesion Strength of a Printed Cu Circuit on Polyimide
CJ Lee, BG Park, KH Jung, Y Kim, SB Jung
Science of Advanced Materials 12 (4), 594-599
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00022
13/
Microstructures and Mechanical Properties of AA6061-T4 Composites Containing SiC and B4C Particles Fabricated by Friction Stir Processing
HJ Park, BW Ahn, JH Kim, JG Lee, SB Jung
Science of Advanced Materials 12 (4), 531-537
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00012
12/
Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint
CJ Lee, JH Kim, H Jeong, JO Bang, SB Jung
Science of Advanced Materials 12 (4), 538-543
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00013
11/
Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes
H Jeong, CJ Lee, WR Myung, KD Min, SB Jung
Science of Advanced Materials 12 (4), 564-570
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00017
10/
Microstructures and Mechanical Properties of AA6061-T4 Composites Containing SiC and B4C Particles Fabricated by Friction Stir Processing
Park, H. J., Ahn, B. W., Kim, J. H., Lee, J. G., Jung, S. B.
Science of Advanced Materials, Vol. 12, p.531 (2020)
https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00012
09/
Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications
SE Jeong, SB Jung, JW Yoon
Thin Solid Films 698, 137873
https://www.sciencedirect.com/science/article/pii/S0040609020300882
08/
Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package
H Jeong, KH Jung, CJ Lee, KD Min, WR Myung, SB Jung
Journal of Materials Science: Materials in Electronics, 1-8
https://link.springer.com/article/10.1007%2Fs10854-020-03243-8
07/
Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications
JW Yoon, S Bae, BS Lee, SB Jung
Applied Surface Science, 146060
https://www.sciencedirect.com/science/article/pii/S0169433220308163
06/
Interfacial reactions and mechanical properties of Sn–3.0 Ag–0.5 Cu solder with pure Pd or Pd (P) layers containing thin-Au/Pd/Ni (P) surface-finished PCBs during aging
J Kim, JH Back, SB Jung, JW Yoon
Journal of Materials Science: Materials in Electronics 31 (5), 4027-4039
https://link.springer.com/article/10.1007/s10854-020-02950-6
05/
Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0 Ag-0.5 Cu/thin-Au/Pd/Ni (P) solder joints
J Kim, SB Jung, JW Yoon
Applied Surface Science 503, 144339
https://www.sciencedirect.com/science/article/pii/S0169433219331551
04/
CJ Lee, JH Kim, BU Hwang, KD Min, SB Jung
Journal of Materials Science: Materials in Electronics 31 (4), 3035-3041
https://link.springer.com/article/10.1007/s10854-019-02847-z
03/
Jeong, H., Myung, W. R., Kim, K. Y., Min, K. D., Jung, S. B.
JH Kim, YR Lee, HJ Park, SW Kim, SB Jung
https://link.springer.com/article/10.1007/s10854-019-02760-5
02/
Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85° C/85% Relative Humidity Environmental Conditions
KD Min, CJ Lee, HJ Park, SB Jung
Journal of Electronic Materials 49 (2), 1527-1533 (2020)
https://link.springer.com/article/10.1007/s11664-019-07863-7
01/
Mechanical, electrical, and thermal reliability of Sn-58wt.% Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment
BG Park, WR Myung, CJ Lee, SB Jung
Composites Part B: Engineering 182, 107617 (2020)
https://www.sciencedirect.com/science/article/pii/S1359836818327586
2019
15/
Effect of Different Surface Finishes on Bending Reliability of the Rigid Printed Circuit Board and Flexible Printed Circuit Board Substrate Joints with the Transverse Ultrasonic Bonding Process
Lee, J. G., Lee, J. B., Kim, S. W., Joo, J. H., Jung, S. B.
Nanoscience and Nanotechnology Letters Vol. 11 p.839 (2019)
https://www.ingentaconnect.com/contentone/asp/nnl/2019/00000011/00000006/art00012
13/
Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder
Lee, C. J., Min, K. D., Park, H. J., Kim, J. H., Jung, S. B.
Electronic Materials Letters Vol. 15 p.693 (2019)
https://link.springer.com/article/10.1007/s13391-019-00176-1
14/
Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages
Jung, K. H., Min, K. D., Lee, C. J., Park, B. G., Jeong, H., Koo, J. M., Lee, B. H., Jung, S. B.
Applied Surface Science Vol. 495 p.143487 (2019)
https://www.sciencedirect.com/science/article/pii/S0169433219322652
12/
The effect of pH on synthesizing Ni-decorated MWCNTs and its applicationfor Sn-58Bi solder
Lee, C. J., Min, K. D., Hwang, B. U., Kim, J. H., Jung, S. B.
Current Applied Physics Vol. 19 p.1182 (2019)
https://www.sciencedirect.com/science/article/pii/S156717391930197X
11/
Optimal Ni(P) thickness and reliability evaluation of thin-Au Pd(P) Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
Kim, J., Jung, S. B., Yoon, J. W.
Journal of Alloys and Compounds Vol. 805 p.1013 (2019)
https://www.sciencedirect.com/science/article/abs/pii/S0925838819326933
10/
Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high‑temperature packaging applications
Min, K. D., Jung, K. H., Lee, C. J., Jeong, H., Jung, S. B.
Journal of Materials Science: Materials in Electronics Vol. 30 p.18848 (2019)
https://link.springer.com/article/10.1007/s10854-019-02241-9
09/
Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints
Lee, C. J., Bang, J. O., Jung, S. B.
Microelectronic Engineering Vol. 216 p.111055 (2019)
https://www.sciencedirect.com/science/article/abs/pii/S0167931719302126
08/
Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging
Kim, J., Back, J. H., Jung, S. B., Yoon, J. W.
Journal of Materials Science: Materials in Electronics Vol. 30 p.12911 (2019)
https://link.springer.com/article/10.1007/s10854-019-01653-x
07/
Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder
Lee, C. J., Jeong, H., Jung, K. H., Min, K. D., Jung, S. B.
Journal of Materials Science: Materials in Electronics Vol. 30 p.12869 (2019)
https://link.springer.com/article/10.1007/s10854-019-01648-8
06/
Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics
Lee, C. J., Park, B. G., Jeong, H., Jung, K. H., Jung, S. B.
Journal of Alloys and Compounds Vol. 794 p.341 (2019)
https://www.sciencedirect.com/science/article/abs/pii/S0925838819315981
05/
Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant
Jung, K. H., Min, K. D., Lee, C. J., Jung, S. B.
Journal of Alloys and Compounds Vol. 781 p.657 (2019)
https://www.sciencedirect.com/science/article/pii/S0925838818345791
04/
Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles
Park, H. J., Lee, C. J., Min, K. D., Jung, S. B.
Journal of Electronic Materials Vol. 48 p.1746 (2019)
https://link.springer.com/article/10.1007/s11664-018-06882-0
03/
Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method
Lee, C. J., Jung, K. H., Park, B. G., Kim, Y., Jung, S. B.
Jounal of Materials Science: Materials in Electronics Vol. 30 p.4079 (2019)
https://link.springer.com/article/10.1007/s10854-019-00696-4
02/
Electromigration behaviors of Sn58% Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB
Kim, J., Jung, K. H., Kim, J. H., Lee, C. J., Jung, S. B.
Journal of Alloys and Compounds Vol. 775 p.581 (2019)
https://www.sciencedirect.com/science/article/pii/S0925838818336946
01/
A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency
Kim, S. W., Ju, Y. H., Han, S., Kim, J. S., Lee, H. J., Han, C. J., Lee, C. R., Jung, S. B., Kim, Y., Kim, J. W.
Journal of Materials Chemistry A Vol. 7 p.22588 (2019)
https://pubs.rsc.org/ko/content/articlelanding/2019/ta/c9ta04634h/unauth#!divAbstract
2018
12/
Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure
Shin, H. W., Jung, S. B., Lee, H. S.
Journal of Electronic Materials Vol. 47 p.7273 (2018)
https://link.springer.com/article/10.1007/s11664-018-6672-0
11/
Enhancing adhesion strength of photonic sintered screen-printed Ag circuit by atmospheric pressure plasma
BG Park, CJ Lee, SB Jung
Microelectronic Engineering 202, 37-41
https://www.sciencedirect.com/science/article/pii/S0167931718304726
10/
Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes
JW Yoon, JH Back, SB Jung
Surface and Interface Analysis 50 (11), 1046-1050
https://onlinelibrary.wiley.com/doi/abs/10.1002/sia.6419
09/
Effect of surface finish metallization on mechanical strength of Ag sintered joint
JW Yoon, JH Back, SB Jung
Microelectronic Engineering 198, 15-21
https://www.sciencedirect.com/science/article/pii/S0167931718302430
08/
1.4 µm-Thick Transparent Radio Frequency Transmission Lines Based on Instant Fusion of Polyethylene Terephthalate Through Surface of Ag Nanowires
SW Kim, KS Kim, M Park, W Nah, DU Kim, CR Lee, SB Jung, JW Kim
ELECTRONIC MATERIALS LETTERS 14 (5), 599-609
https://link.springer.com/article/10.1007/s13391-018-0069-3
07/
Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test
H Jeong, WR Myung, YG Sung, KY Kim, SB Jung
Journal of nanoscience and nanotechnology 18 (9), 6316-6320
https://www.ingentaconnect.com/contentone/asp/jnn/2018/00000018/00000009/art00084
06/
Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85° C/85% Relative Humidity Environmental Conditions
KY Kim, WR Myung, H Jeong, YG Sung, SB Jung
Journal of Nanoscience and Nanotechnology 18 (9), 6162-6166
https://www.ingentaconnect.com/contentone/asp/jnn/2018/00000018/00000009/art00056
05/
Mechanical Reliability of the Epoxy Sn-58wt.% Bi Solder Joints with Different Surface Finishes Under Thermal Shock
YG Sung, WR Myung, H Jeong, MK Ko, J Moon, SB Jung
Journal of Electronic Materials 47 (7), 4165-4169
https://link.springer.com/article/10.1007/s11664-018-6224-7
04/
Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy
KH Jung, J Kim, BG Park, CJ Lee, HJ Sung, SB Jung
Journal of Alloys and Compounds 748, 898-904
https://www.sciencedirect.com/science/article/pii/S0925838818310399
03/
Transparent and flexible high frequency transmission lines based on composite structure comprising silver nanowires and polyvinyl butyral
SW Kim, K Kim, W Nah, CR Lee, SB Jung, JW Kim
Composites Science and Technology 159, 25-32
https://www.sciencedirect.com/science/article/pii/S0266353817326155
02/
RF characteristics of flexible circuits patterned with hybrid Ag paste
KH Jung, SW Kim, MK Maeng, DG Kam, SB Jung
Journal of Materials Science: Materials in Electronics 29 (6), 5074-5081
https://link.springer.com/article/10.1007/s10854-017-8470-5
01/
Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints
JW Yoon, JH Back, SB Jung
Journal of Materials Science: Materials in Electronics 29 (6), 4724-4731
2017
13/
The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking
WR Myung, KY Kim, Y Kim, SB Jung
Journal of Materials Science: Materials in Electronics 28 (21), 16467-16475
https://link.springer.com/article/10.1007/s10854-017-7558-2
12/
Effect of Sodium Dodecylbenzene Sulfonate Contents on Oxide Behavior in Cu Nanopaste
CJ Lee, KY Kim, KH Jung, SB Jung
Journal of Nanoscience and Nanotechnology 17 (10), 7497-7501
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000010/art00080
11/
Enhancement of Cu pillar bumps by electroless Ni plating
BS Lee, SB Jung, JW Yoon
Microelectronic Engineering 180, 52-55
https://www.sciencedirect.com/science/article/pii/S0167931717302770
10/
Evaluation of the Long-Term Reliability of the Epoxy-Contained SAC305 Solder with Organic Solderability Preservative Surface Finish
YG Sung, WR Myung, H Jung, KY Kim, SB Jung
Nanoscience and Nanotechnology Letters 9 (8), 1202-1206
https://www.ingentaconnect.com/content/asp/nnl/2017/00000009/00000008/art00011
09/
Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy
WR Myung, YG Sung, J Moon, SB Jung
Nanoscience and Nanotechnology Letters 9 (8), 1190-1194
https://www.ingentaconnect.com/contentone/asp/nnl/2017/00000009/00000008/art00009
08/
Thermo-Mechanical Behavior of Die Attach Film on Flexible PCB Substrate for Multi-Chip Package
JO Bang, KH Jung, YM Lee, SB Jung
Journal of Nanoscience and Nanotechnology 17 (5), 3130-3134
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000005/art00043
07/
Bondability and Reliability of Multi-Chip Packages Bonded with Non-Conductive Paste Using Thermal Compression Energy and Ultrasonic Energy
JG Lee, JB Lee, WR Myung, JW Yoon, SB Jung
Journal of Nanoscience and Nanotechnology 17 (5), 2937-2942
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000005/art00011
06/
Fabrication of Sn–58Bi–xCe Solder Paste Using Electrical Wire Explosion Method and its Mechanical Property
JO Bang, HS Lee, SB Jung
Journal of Nanoscience and Nanotechnology 17 (5), 3033-3037
https://www.ingentaconnect.com/contentone/asp/jnn/2017/00000017/00000005/art00025
05/
Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility
BG Park, KH Jung, SB Jung
Journal of Alloys and Compounds 699, 1186-1191
https://www.sciencedirect.com/science/article/pii/S0925838816342244
04/
Microstructure and mechanical properties of a B4C particle-reinforced Cu matrix composite fabricated by friction stir welding
BW Ahn, JH Kim, K Hamad, SB Jung
Journal of Alloys and Compounds 693, 688-691
https://www.sciencedirect.com/science/article/pii/S0925838816327062
03/
Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods
JH Lim, SM Lee, HS Kim, HY Kim, J Park, SB Jung, GC Park, J Kim, J Joo
Scientific reports 7, 41992
https://www.nature.com/articles/srep41992
02/
Analysis of peel strength of consisting of an aluminum sheet, anodic aluminum oxide and a copper foil laminate composite
HW Shin, HS Lee, SB Jung
Metals and Materials International 23 (1), 207-213
https://link.springer.com/article/10.1007/s12540-017-6493-3
01/
Photo-induced fabrication of Ag nanowire circuitry for invisible, ultrathin, conformable pressure sensors
CJ Han, BG Park, MS Oh, SB Jung, JW Kim
Journal of Materials Chemistry C 5 (38), 9986-9994
http://pubs.rsc.org/en/content/articlehtml/2017/tc/c7tc01423f
2016
19/
Adhesion of PDMS substrates assisted by Plasma Graft Polymerization
Jung, K. H., Kim, D. G., & Jung, S. B.
Surface and Interface Analysis Vol.48 p597 (2016)
https://onlinelibrary.wiley.com/doi/abs/10.1002/sia.5985
18/
High-Temperature Oxidation of Ti–44Al–6Nb–2Cr–0.3 Si–0.1 C Alloy
Park, S. Y., Seo, D. Y., Kim, S. W., Kim, S. E., Hong, J. K., Jung, S. B., Bak, S. H., Lee, D. B.
Science of Advanced Materials Vol.8 p2264 (2016)
https://www.ingentaconnect.com/contentone/asp/sam/2016/00000008/00000012/art00013
17/
Effects of Precursor Concentration on Morphology of MoS2 Nanosheets by Hydrothermal Synthesis
Lee, C. M., Park, G. C., Lee, S. M., Choi, J. H., Jeong, S. H., Seo, T. Y., Jung, S. B., Lim, J. H., Joo, J.
JJournal of Nanoscience and Nanotechnology 16 (11), 11548-11551
https://www.ingentaconnect.com/contentone/asp/jnn/2016/00000016/00000011/art00085
16/
Effects of Hydrothermal Temperature on Crystallinity, Microstructure, and Photocatalytic Activity of Anatase TiO2 Mesocrystals
Seo, T. Y., Lee, S. M., Choi, J. H., Lee, C. M., Park, G. C., Jeong, S. H., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (11), 11153-11157
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00006
15/
Enhanced photocatalytic activity of ZnO nanorods with tubular facet synthesized by hydrothermal method
Park, G. C., Lee, S. M., Jeong, S. H., Choi, J. H., Lee, C. M., Seo, T. Y., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (11), 11164-11168
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00008
14/
Effect of Al incorporation on morphology and electrical conductivity of ZnO nanorods prepared using hydrothermal method
Jeong, S. H., Park, G. C., Choi, J. H., Lee, C. M., Lee, S. M., Seo, T. Y., Choi, D. H., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (11), 11272-11276
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00028
13/
Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB
Kim, J., Myung, W. R., Jung, S. B.
Journal of Electronic Materials 45 (11), 5895-5903
https://link.springer.com/article/10.1007/s11664-016-4803-z
12/
Morphology Control in Anatase TiO2 Mesocrystals Through Hydrofluoride Incorporation for Photocatalytic Application
Lee, S. M., Seo, T. Y., Park, G. C., Choi, J. H., Jeong, S. H., Jung, S. B., Choi, D. H., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (10), 10592-10596
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000010/art00080
11/
Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor
Kim, D. G., Kim, J., Jung, S. B., Kim, Y. S., Kim, J. W. (2016).
Applied Surface Science 380, 223-228
https://www.sciencedirect.com/science/article/pii/S0169433216001677
10/
Fabrication of Cu–MWNT nanocomposite and its electrochemical migration behaviors
Kim, K. S., Jung, S. B., Kim, D. U.
Journal of Materials Science: Materials in Electronics 27 (9), 9676-9682
https://link.springer.com/article/10.1007/s10854-016-5028-x
09/
Facet-controlled anatase TiO2 nanoparticles through various fluorine sources for superior photocatalytic activity
Lee, S. M., Park, G. C., Seo, T. Y., Jung, S. B., Lee, J. H., Kim, Y. D., Choi, D. H., Lim, J. H., Joo, J.
Nanotechnology 27 (39), 395604
http://iopscience.iop.org/article/10.1088/0957-4484/27/39/395604/meta
08/
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications
Kim, D. U., Kim, K. S., Jung, S. B.
Microelectronics Reliability 63, 120-124
https://www.sciencedirect.com/science/article/pii/S0026271416301135
07/
Drop Reliability of Epoxy-contained Sn-58 wt.% Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Myung, W. R., Kim, Y., Kim, K. Y., Jung, S. B.
Journal of Electronic Materials 45 (7), 3651-3658
https://link.springer.com/article/10.1007/s11664-016-4517-2
06/
Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints
Yoon, J. W., Jung, S. B.
Materials Transactions 57 (5), 716-720
https://www.jstage.jst.go.jp/article/matertrans/57/5/57_M2016006/_article/-char/ja/
05/
Microstructures and mechanical properties of MgOp/SPHC metal matrix composites joint by friction stir welding
Ahn, B. W., Kim, J. H., Choi, D. H., Jung, S. B.
Journal of Composite Materials 50 (12), 1581-1586
http://journals.sagepub.com/doi/abs/10.1177/0021998315579231
04/
Fabrication of high quality carbonaceous coating on Cu nanoparticle using poly (vinyl pyrrolidone) and its application for oxidation prevention
Pyo, Y., Choi, D., Son, Y. H., Kang, S., Yoon, E. H., Jung, S. B., Kim, Y., Lee, C. S.
Japanese Journal of Applied Physics 55 (5), 055001
http://iopscience.iop.org/article/10.7567/JJAP.55.055001/meta
03/
Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes
Lee, S. M., Yoon, J. W., Jung, S. B.
MATERIALS TRANSACTIONS 57 (3), 466-471
https://www.jstage.jst.go.jp/article/matertrans/57/3/57_M2015260/_article/-char/ja/
02/
Electromigration effect on Sn-58% Bi solder joints with various substrate metallizations under current stress
Lee, S. M., Yoon, J. W., Jung, S. B. (2016).
Journal of Materials Science: Materials in Electronics 27 (2), 1105-1112
https://link.springer.com/article/10.1007/s10854-015-3858-6
01/
Application of the Taguchi Method to Optimize Graphene Coatings on Copper Nanoparticles Formed Using a Solid Carbon Source
Choi, D., Pyo, Y., Jung, S. B., Kim, Y., Yoon, E. H., Lee, C. S.
Materials Transactions, M2016011
https://www.jstage.jst.go.jp/article/matertrans/57/7/57_M2016011/_article/-char/ja/
2015
15/
High-temperature oxidation of AZ91D/Y2O3 magnesium composites in air
Youn, J.I., Kim, Y.J., Jung, S.B., Lee, D.B.
Science of Advanced Materials Vol.7 p.97 (2015)
http://www.ingentaconnect.com/content/asp/sam/2015/00000007/00000001/art00014
14/
Wire Sweep Characterization in System-in-Package (SiP) Component with Au Wire Bonding During Epoxy Molding Compounds Molding Process
Woo-Ram Myung, Jae-Oh Bang, Sang-Su Ha, Dae Up Kim, Seung-Boo Jung
Nanoscience and Nanotechnology Letters Vol.7 p.994 (2015)
http://www.ingentaconnect.com/contentone/asp/nnl/2015/00000007/00000012/art00010
13/
Effects of Polyvinylpyrrolidone Molecular Weight on Adhesion Strength of Screen-Printed Cu Circuits to Polyimide Substrate
Kwang-Ho Jung, Bum-Geun Park, Seung-Boo Jung
Nanoscience and Nanotechnology Letters Vol.7 p.999 (2015)
http://www.ingentaconnect.com/contentone/asp/nnl/2015/00000007/00000012/art00011
12/
Effect of radio frequency plasma treatment on evaporation behavior and characteristics of RuCr alloy powder
Jung, T.-K., Lim, S.-C., Kwon, H.-C., Park, S.-K., Ho, J.-W., Jung, S.-B., Baek, J.-J., Jang, K.-B.
Journal of Nanoscience and Nanotechnology Vol.15 p.8424 (2015)
http://www.ingentaconnect.com/content/asp/jnn/2015/00000015/00000011/art00012
11/
Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes
Myung, W.-R., Kim, Y., Jung, S.-B.
Journal of Electronic Materials Vol.44 p.4637 (2015)
http://link.springer.com/article/10.1007/s11664-015-4024-x
10/
Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder
Myung, W.-R., Ko, M.-K., Kim, Y., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.26 p.8707 (2015)
http://link.springer.com/article/10.1007/s10854-015-3546-6
09/
The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste
Kim, K.-S., Park, B.-G., Jung, K.-H., Jung, S.-B., Kim, J.-W.
Journal of Materials Science: Materials in Electronics Vol.26 p.8644 (2015)
http://link.springer.com/article/10.1007/s10854-015-3539-5
08/
Enhancing Adhesion of Screen-Printed Silver Nanopaste Films
Kim, J.-H., Kim, K.-S., Jang, K.-R., Jung, S.-B., Kim, T.-S.
Advanced Materials Interfaces Vol.2 p.1500283 (2015)
http://onlinelibrary.wiley.com/doi/10.1002/admi.201500283/full
07/
Fabrication of SiCp/2024 composite alloys using friction stir welding and its mechanical properties
Ahn, B.-W., Choi, D.-H., Kim, J.-H., Yeon, Y.-M., Kim, D.-U., Shin, Y.-E., Jung, S.-B.
Science of Advanced Materials Vol.7 p.1535 (2015)
http://www.ingentaconnect.com/content/asp/sam/2015/00000007/00000008/art00018
06/
Hydrothermally grown in-doped zno nanorods on p-gan films for color-tunable heterojunction light-emitting-diodes
Park, G.C., Hwang, S.M., Lee, S.M., Choi, J.H., Song, K.M., Kim, H.Y., Kim, H.-S., Eum, S.-J., Jung, S.-B., Lim, J.H., Joo, J.
Scientific Reports Vol.5 p.10410 (2015)
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC4437377/
05/
Fabrication of Ag-MWNT nanocomposite paste for high-power LED package
Kim, K.-S., Park, B.-G., Kim, H., Lee, H.-S., Jung, S.-B.
Current Applied Physics Vol.15 p.S36 (2015)
http://www.sciencedirect.com/science/article/pii/S1567173915000838
04/
Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints
Yoon, J.-W., Bang, J.-H., Lee, C.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.627 p.276 (2015)
http://www.sciencedirect.com/science/article/pii/S0925838814030230
03/
Microwave sintering of silver nanoink for radio frequency applications
Kim, K.-S., Park, B.-G., Jung, K.-H., Kim, J.-W., Jeong, M.Y., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.15 p.2333 (2015)
http://www.ingentaconnect.com/content/asp/jnn/2015/00000015/00000003/art00059
02/
Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions
Lee, S.-M., Yoon, J.-W., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.26 p.1649 (2015)
http://link.springer.com/article/10.1007/s10854-014-2589-4
01/
Characteristics of Nanophase WC and WC-3 wt% (Ni, Co, and Fe) Alloys Using a Rapid Sintering Process for the Application of Friction Stir Processing Tools
Kim, D., Choi, Y., Kim, Y., Jung, S.
Application of Friction Stir Processing Tools
Advances in Materials Science and Engineering Vol.2015 p.343619 (2015)
https://www.hindawi.com/journals/amse/2015/343619/