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2021

06/

Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior

CJ Lee, DG Kang, BU Hwang, KD Min, J Joo, SB Jung

Journal of Alloys and Compounds 863, 158726

https://doi.org/10.1016/j.jallcom.2021.158726

05/

Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

KD Min, KH Jung, CJ Lee, BU Hwang, SB Jung

Journal of Alloys and Compounds 857, 157595

https://www.sciencedirect.com/science/article/pii/S0925838820339591

04/

Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)

JH Kim, CJ Lee, KD Min, BU Hwang, DG Kang, DH Choi, J Joo, SB Jung

Composite Structures 258, 113364

https://www.sciencedirect.com/science/article/pii/S0263822320332906

03/

Design and analysis of Cu circuit for stretchable electronic circuits using finite element analysis

KY Kim, CJ Lee, SB Jung

Microelectronic Engineering, 111510

https://www.sciencedirect.com/science/article/pii/S0167931721000125

02/

Effect of Ni (P) thickness in Au/Pd/Ni (P) surface finish on the electrical reliability of Sn–3.0 Ag–0.5 Cu solder joints during current-stressing

J Kim, SB Jung, JW Yoon

Journal of Alloys and Compounds 850, 156729

https://www.sciencedirect.com/science/article/pii/S0925838820330930

2020

33/

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

HS Joo, CJ Lee, KD Min, BU Hwang, SB Jung

Journal of Materials Science: Materials in Electronics 31 (24), 22926-22932

https://link.springer.com/article/10.1007/s10854-020-04819-0

32/

The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature

CJ Lee, KD Min, H Jeong, BU Hwang, SB Jung

Journal of Electronic Materials 49 (11), 6746-6753

https://link.springer.com/article/10.1007/s11664-020-08426-x

31/

Electromigration behavior of Cu core solder joints under high current density

H Jeong, CJ Lee, JH Kim, J Son, SB Jung

ELECTRONIC MATERIALS LETTERS 16 (6), 513-519

https://link.springer.com/article/10.1007/s13391-020-00239-8

30/

Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

KD Min, KH Jung, CJ Lee, BU Hwang, SB Jung

Journal of Alloys and Compounds, 157595

https://www.sciencedirect.com/science/article/pii/S0925838820339591

29/

Bending reliability of Ni–MWCNT composite solder with a differential structure

CJ Lee, BU Hwang, KD Min, JH Kim, SB Jung

Microelectronics Reliability 113, 113934

https://www.sciencedirect.com/science/article/pii/S0026271420307654

28/

Mechanical properties of Cu-core solder balls with ENEPIG surface finish

H Jeong, CJ Lee, KD Min, J Son, SB Jung

Journal of Electronic Materials 49 (10), 6073-6079

https://link.springer.com/article/10.1007/s11664-020-08338-w

27/

Effects of Ni (P) layer thickness and Pd layer type in thin-Au/Pd/Ni (P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging

J Kim, SB Jung, JW Yoon

Journal of Materials Science: Materials in Electronics, 1-23

https://link.springer.com/article/10.1007/s10854-020-04509-x

26/

Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

H Jeong, KD Min, CJ Lee, JH Kim, SB Jung

Microelectronics Reliability 112, 113918

https://www.sciencedirect.com/science/article/pii/S0026271420307496

25/

Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications

SE Jeong, SB Jung, JW Yoon

Journal of Materials Science: Materials in Electronics 31 (18), 15048-15060

https://link.springer.com/article/10.1007/s10854-020-04068-1

24/

Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test

BU Hwang, KD Min, CJ Lee, JH Kim, SB Jung

Materialia 12, 100808

https://www.sciencedirect.com/science/article/pii/S2589152920302246

23/

Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

KD Min, KH Jung, CJ Lee, H Jeong, BU Hwang, SB Jung

ELECTRONIC MATERIALS LETTERS 16, 347–354

https://link.springer.com/article/10.1007%2Fs13391-020-00221-4

22/

Ultra‐Fast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy

KH Jung, K Deuk Min, CJ Lee, H Jeong, JH Kim, SB Jung

Advanced Engineering Materials 22, 2000179

https://onlinelibrary.wiley.com/doi/full/10.1002/adem.202000179

21/

Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

CJ Lee, WR Myung, BG Park, SB Jung

Journal of Materials Science: Materials in Electronics, 1-7

https://link.springer.com/article/10.1007%2Fs10854-020-03562-w

20/

Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross‑Linking Process

CJ Lee, BU Hwang, H Jeong, KD Min, SB Jung

ELECTRONIC MATERIALS LETTERS 16, 332–339

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00012

19/

Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering

CJ Lee, KH Jung, KD Min, BG Park, SB Jung

Journal of Materials Science & Technology Vol. 53, 15

https://www.sciencedirect.com/science/article/pii/S100503022030339X

18/

Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint

J Kim, SB Jung, JW Yoon

Journal of Alloys and Compounds 820, 153396

https://www.sciencedirect.com/science/article/pii/S0925838819346420

17/

Mechanical properties of Sn-58 wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests

CJ Lee, KD Min, HJ Park, SB Jung

Journal of Alloys and Compounds 820, 153077

https://www.sciencedirect.com/science/article/pii/S0925838819343233

16/

Mechanical Properties and Microstructure of Cu Core Solder Ball (CCSB) Compared with SAC305 Solder for 2.5D and 3D Structure Package (PKG)

JY Son, H Jeong, S Lee, Y Lee, SB Jung

Science of Advanced Materials 12 (4), 556-563

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00016

15/

Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

H Jeong, WR Myung, KY Kim, KD Min, SB Jung

Science of Advanced Materials 12 (4), 525-530

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00011

14/

Effects of Silane Coupling Agents on the Adhesion Strength of a Printed Cu Circuit on Polyimide

CJ Lee, BG Park, KH Jung, Y Kim, SB Jung

Science of Advanced Materials 12 (4), 594-599

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00022

13/

Microstructures and Mechanical Properties of AA6061-T4 Composites Containing SiC and B4C Particles Fabricated by Friction Stir Processing

HJ Park, BW Ahn, JH Kim, JG Lee, SB Jung

Science of Advanced Materials 12 (4), 531-537

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00012

12/

Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint

CJ Lee, JH Kim, H Jeong, JO Bang, SB Jung

Science of Advanced Materials 12 (4), 538-543

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00013

11/

Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes

H Jeong, CJ Lee, WR Myung, KD Min, SB Jung

Science of Advanced Materials 12 (4), 564-570

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00017

10/

Microstructures and Mechanical Properties of AA6061-T4 Composites Containing SiC and B4C Particles Fabricated by Friction Stir Processing

Park, H. J., Ahn, B. W., Kim, J. H., Lee, J. G., Jung, S. B.

Science of Advanced Materials, Vol. 12, p.531 (2020)

https://www.ingentaconnect.com/content/asp/sam/2020/00000012/00000004/art00012

09/

Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications

SE Jeong, SB Jung, JW Yoon

Thin Solid Films 698, 137873

https://www.sciencedirect.com/science/article/pii/S0040609020300882

08/

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

H Jeong, KH Jung, CJ Lee, KD Min, WR Myung, SB Jung

Journal of Materials Science: Materials in Electronics, 1-8

https://link.springer.com/article/10.1007%2Fs10854-020-03243-8

07/

Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

JW Yoon, S Bae, BS Lee, SB Jung

Applied Surface Science, 146060

https://www.sciencedirect.com/science/article/pii/S0169433220308163

06/

Interfacial reactions and mechanical properties of Sn–3.0 Ag–0.5 Cu solder with pure Pd or Pd (P) layers containing thin-Au/Pd/Ni (P) surface-finished PCBs during aging

J Kim, JH Back, SB Jung, JW Yoon

Journal of Materials Science: Materials in Electronics 31 (5), 4027-4039

https://link.springer.com/article/10.1007/s10854-020-02950-6

05/

Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0 Ag-0.5 Cu/thin-Au/Pd/Ni (P) solder joints

J Kim, SB Jung, JW Yoon

Applied Surface Science 503, 144339

https://www.sciencedirect.com/science/article/pii/S0169433219331551

04/

Effect of SDBS on the oxidation reliability of screen-printed Cu circuits

CJ Lee, JH Kim, BU Hwang, KD Min, SB Jung

Journal of Materials Science: Materials in Electronics 31 (4), 3035-3041

https://link.springer.com/article/10.1007/s10854-019-02847-z

03/

Microstructures and thermal properties of Ag-CNT/Cu composites fabricated by friction stir welding

Jeong, H., Myung, W. R., Kim, K. Y., Min, K. D., Jung, S. B.

JH Kim, YR Lee, HJ Park, SW Kim, SB Jung

https://link.springer.com/article/10.1007/s10854-019-02760-5

02/

Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85° C/85% Relative Humidity Environmental Conditions

KD Min, CJ Lee, HJ Park, SB Jung

Journal of Electronic Materials 49 (2), 1527-1533 (2020)

https://link.springer.com/article/10.1007/s11664-019-07863-7

01/

Mechanical, electrical, and thermal reliability of Sn-58wt.% Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment

BG Park, WR Myung, CJ Lee, SB Jung

Composites Part B: Engineering 182, 107617 (2020)

https://www.sciencedirect.com/science/article/pii/S1359836818327586

2019

15/

Effect of Different Surface Finishes on Bending Reliability of the Rigid Printed Circuit Board and Flexible Printed Circuit Board Substrate Joints with the Transverse Ultrasonic Bonding Process

Lee, J. G., Lee, J. B., Kim, S. W., Joo, J. H., Jung, S. B.

Nanoscience and Nanotechnology Letters Vol. 11 p.839 (2019)

https://www.ingentaconnect.com/contentone/asp/nnl/2019/00000011/00000006/art00012

13/

Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Lee, C. J., Min, K. D., Park, H. J., Kim, J. H., Jung, S. B.

Electronic Materials Letters Vol. 15 p.693 (2019)

https://link.springer.com/article/10.1007/s13391-019-00176-1

14/

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Jung, K. H., Min, K. D., Lee, C. J., Park, B. G., Jeong, H., Koo, J. M., Lee, B. H., Jung, S. B.

Applied Surface Science Vol. 495 p.143487 (2019)

https://www.sciencedirect.com/science/article/pii/S0169433219322652

12/

 The effect of pH on synthesizing Ni-decorated MWCNTs and its applicationfor Sn-58Bi solder

Lee, C. J., Min, K. D., Hwang, B. U., Kim, J. H., Jung, S. B.

Current Applied Physics Vol. 19 p.1182 (2019)

https://www.sciencedirect.com/science/article/pii/S156717391930197X

11/

Optimal Ni(P) thickness and reliability evaluation of thin-Au Pd(P) Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints

Kim, J., Jung, S. B., Yoon, J. W.

Journal of Alloys and Compounds Vol. 805 p.1013 (2019)

https://www.sciencedirect.com/science/article/abs/pii/S0925838819326933

10/

Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high‑temperature packaging applications

Min, K. D., Jung, K. H., Lee, C. J., Jeong, H., Jung, S. B.

Journal of Materials Science: Materials in Electronics Vol. 30 p.18848 (2019)

https://link.springer.com/article/10.1007/s10854-019-02241-9

09/

Effect of black residue on the mechanical properties of Sn-58Bi epoxy solder joints

Lee, C. J., Bang, J. O., Jung, S. B. 

Microelectronic Engineering Vol. 216 p.111055 (2019)

https://www.sciencedirect.com/science/article/abs/pii/S0167931719302126

08/

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging

Kim, J., Back, J. H., Jung, S. B., Yoon, J. W.

Journal of Materials Science: Materials in Electronics Vol. 30 p.12911 (2019)

https://link.springer.com/article/10.1007/s10854-019-01653-x

07/

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Lee, C. J., Jeong, H., Jung, K. H., Min, K. D., Jung, S. B.

Journal of Materials Science: Materials in Electronics Vol. 30 p.12869 (2019)

https://link.springer.com/article/10.1007/s10854-019-01648-8

06/

Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics

Lee, C. J., Park, B. G., Jeong, H., Jung, K. H., Jung, S. B.

Journal of Alloys and Compounds Vol. 794 p.341 (2019)

https://www.sciencedirect.com/science/article/abs/pii/S0925838819315981

05/

Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant

Jung, K. H., Min, K. D., Lee, C. J., Jung, S. B. 

Journal of Alloys and Compounds Vol. 781 p.657 (2019)

https://www.sciencedirect.com/science/article/pii/S0925838818345791

04/

Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles

Park, H. J., Lee, C. J., Min, K. D., Jung, S. B.

Journal of Electronic Materials Vol. 48 p.1746 (2019)

https://link.springer.com/article/10.1007/s11664-018-06882-0

03/

Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method

Lee, C. J., Jung, K. H., Park, B. G., Kim, Y., Jung, S. B.

Jounal of Materials  Science: Materials in Electronics Vol. 30 p.4079 (2019)

https://link.springer.com/article/10.1007/s10854-019-00696-4

02/

Electromigration behaviors of Sn58% Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB

Kim, J., Jung, K. H., Kim, J. H., Lee, C. J., Jung, S. B.
Journal of Alloys and Compounds Vol. 775 p.581 (2019)
https://www.sciencedirect.com/science/article/pii/S0925838818336946

01/

A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Kim, S. W., Ju, Y. H., Han, S., Kim, J. S., Lee, H. J., Han, C. J., Lee, C. R., Jung, S. B., Kim, Y., Kim, J. W.

Journal of Materials Chemistry A Vol. 7 p.22588 (2019)

https://pubs.rsc.org/ko/content/articlelanding/2019/ta/c9ta04634h/unauth#!divAbstract

2016

19/

Adhesion of PDMS substrates assisted by Plasma Graft Polymerization

Jung, K. H., Kim, D. G., & Jung, S. B.
Surface and Interface Analysis Vol.48 p597 (2016)
https://onlinelibrary.wiley.com/doi/abs/10.1002/sia.5985

18/

High-Temperature Oxidation of Ti–44Al–6Nb–2Cr–0.3 Si–0.1 C Alloy

Park, S. Y., Seo, D. Y., Kim, S. W., Kim, S. E., Hong, J. K., Jung, S. B., Bak, S. H., Lee, D. B. 
Science of Advanced Materials Vol.8 p2264 (2016)
https://www.ingentaconnect.com/contentone/asp/sam/2016/00000008/00000012/art00013

17/

Effects of Precursor Concentration on Morphology of MoS2 Nanosheets by Hydrothermal Synthesis

Lee, C. M., Park, G. C., Lee, S. M., Choi, J. H., Jeong, S. H., Seo, T. Y., Jung, S. B., Lim, J. H., Joo, J.
JJournal of Nanoscience and Nanotechnology 16 (11), 11548-11551
https://www.ingentaconnect.com/contentone/asp/jnn/2016/00000016/00000011/art00085

16/

Effects of Hydrothermal Temperature on Crystallinity, Microstructure, and Photocatalytic Activity of Anatase TiO2 Mesocrystals

Seo, T. Y., Lee, S. M., Choi, J. H., Lee, C. M., Park, G. C., Jeong, S. H., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (11), 11153-11157
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00006

15/

Enhanced photocatalytic activity of ZnO nanorods with tubular facet synthesized by hydrothermal method

Park, G. C., Lee, S. M., Jeong, S. H., Choi, J. H., Lee, C. M., Seo, T. Y., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (11), 11164-11168
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00008

14/

Effect of Al incorporation on morphology and electrical conductivity of ZnO nanorods prepared using hydrothermal method

Jeong, S. H., Park, G. C., Choi, J. H., Lee, C. M., Lee, S. M., Seo, T. Y., Choi, D. H., Jung, S. B., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (11), 11272-11276
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000011/art00028

13/

Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

Kim, J., Myung, W. R., Jung, S. B.
Journal of Electronic Materials 45 (11), 5895-5903
https://link.springer.com/article/10.1007/s11664-016-4803-z

12/

Morphology Control in Anatase TiO2 Mesocrystals Through Hydrofluoride Incorporation for Photocatalytic Application

Lee, S. M., Seo, T. Y., Park, G. C., Choi, J. H., Jeong, S. H., Jung, S. B., Choi, D. H., Lim, J. H., Joo, J.
Journal of Nanoscience and Nanotechnology 16 (10), 10592-10596
https://www.ingentaconnect.com/content/asp/jnn/2016/00000016/00000010/art00080

11/

Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor

Kim, D. G., Kim, J., Jung, S. B., Kim, Y. S., Kim, J. W. (2016).
Applied Surface Science 380, 223-228
https://www.sciencedirect.com/science/article/pii/S0169433216001677

10/

Fabrication of Cu–MWNT nanocomposite and its electrochemical migration behaviors

Kim, K. S., Jung, S. B., Kim, D. U.
Journal of Materials Science: Materials in Electronics 27 (9), 9676-9682
https://link.springer.com/article/10.1007/s10854-016-5028-x

09/

Facet-controlled anatase TiO2 nanoparticles through various fluorine sources for superior photocatalytic activity

Lee, S. M., Park, G. C., Seo, T. Y., Jung, S. B., Lee, J. H., Kim, Y. D., Choi, D. H., Lim, J. H., Joo, J.
Nanotechnology 27 (39), 395604
http://iopscience.iop.org/article/10.1088/0957-4484/27/39/395604/meta

08/

Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications

Kim, D. U., Kim, K. S., Jung, S. B.
Microelectronics Reliability 63, 120-124
https://www.sciencedirect.com/science/article/pii/S0026271416301135

07/

Drop Reliability of Epoxy-contained Sn-58 wt.% Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung, W. R., Kim, Y., Kim, K. Y., Jung, S. B. 
Journal of Electronic Materials 45 (7), 3651-3658
https://link.springer.com/article/10.1007/s11664-016-4517-2

06/

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Yoon, J. W., Jung, S. B.
Materials Transactions 57 (5), 716-720
https://www.jstage.jst.go.jp/article/matertrans/57/5/57_M2016006/_article/-char/ja/

05/

Microstructures and mechanical properties of MgOp/SPHC metal matrix composites joint by friction stir welding

Ahn, B. W., Kim, J. H., Choi, D. H., Jung, S. B.
Journal of Composite Materials 50 (12), 1581-1586
http://journals.sagepub.com/doi/abs/10.1177/0021998315579231

04/

Fabrication of high quality carbonaceous coating on Cu nanoparticle using poly (vinyl pyrrolidone) and its application for oxidation prevention

Pyo, Y., Choi, D., Son, Y. H., Kang, S., Yoon, E. H., Jung, S. B., Kim, Y., Lee, C. S.
Japanese Journal of Applied Physics 55 (5), 055001
http://iopscience.iop.org/article/10.7567/JJAP.55.055001/meta

03/

Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes

Lee, S. M., Yoon, J. W., Jung, S. B.
MATERIALS TRANSACTIONS 57 (3), 466-471

https://www.jstage.jst.go.jp/article/matertrans/57/3/57_M2015260/_article/-char/ja/

02/

Electromigration effect on Sn-58% Bi solder joints with various substrate metallizations under current stress

Lee, S. M., Yoon, J. W., Jung, S. B. (2016).
Journal of Materials Science: Materials in Electronics 27 (2), 1105-1112
https://link.springer.com/article/10.1007/s10854-015-3858-6

01/

Application of the Taguchi Method to Optimize Graphene Coatings on Copper Nanoparticles Formed Using a Solid Carbon Source

Choi, D., Pyo, Y., Jung, S. B., Kim, Y., Yoon, E. H., Lee, C. S.
Materials Transactions, M2016011

https://www.jstage.jst.go.jp/article/matertrans/57/7/57_M2016011/_article/-char/ja/

2015

15/

High-temperature oxidation of AZ91D/Y2O3 magnesium composites in air

Youn, J.I., Kim, Y.J., Jung, S.B., Lee, D.B.
Science of Advanced Materials Vol.7 p.97 (2015)
http://www.ingentaconnect.com/content/asp/sam/2015/00000007/00000001/art00014

14/

Wire Sweep Characterization in System-in-Package (SiP) Component with Au Wire Bonding During Epoxy Molding Compounds Molding Process

Woo-Ram Myung, Jae-Oh Bang, Sang-Su Ha, Dae Up Kim, Seung-Boo Jung
Nanoscience and Nanotechnology Letters Vol.7 p.994 (2015)
http://www.ingentaconnect.com/contentone/asp/nnl/2015/00000007/00000012/art00010

13/

Effects of Polyvinylpyrrolidone Molecular Weight on Adhesion Strength of Screen-Printed Cu Circuits to Polyimide Substrate

Kwang-Ho Jung, Bum-Geun Park, Seung-Boo Jung
Nanoscience and Nanotechnology Letters Vol.7 p.999 (2015)
http://www.ingentaconnect.com/contentone/asp/nnl/2015/00000007/00000012/art00011

12/

Effect of radio frequency plasma treatment on evaporation behavior and characteristics of RuCr alloy powder

Jung, T.-K., Lim, S.-C., Kwon, H.-C., Park, S.-K., Ho, J.-W., Jung, S.-B., Baek, J.-J., Jang, K.-B.
Journal of Nanoscience and Nanotechnology Vol.15 p.8424 (2015)
http://www.ingentaconnect.com/content/asp/jnn/2015/00000015/00000011/art00012

11/

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Myung, W.-R., Kim, Y., Jung, S.-B.
Journal of Electronic Materials Vol.44 p.4637 (2015)
http://link.springer.com/article/10.1007/s11664-015-4024-x

10/

Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder

Myung, W.-R., Ko, M.-K., Kim, Y., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.26 p.8707 (2015)
http://link.springer.com/article/10.1007/s10854-015-3546-6

09/

The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste

Kim, K.-S., Park, B.-G., Jung, K.-H., Jung, S.-B., Kim, J.-W.
Journal of Materials Science: Materials in Electronics Vol.26 p.8644 (2015)
http://link.springer.com/article/10.1007/s10854-015-3539-5

08/

Enhancing Adhesion of Screen-Printed Silver Nanopaste Films

Kim, J.-H., Kim, K.-S., Jang, K.-R., Jung, S.-B., Kim, T.-S.
Advanced Materials Interfaces Vol.2 p.1500283 (2015)
http://onlinelibrary.wiley.com/doi/10.1002/admi.201500283/full

07/

Fabrication of SiCp/2024 composite alloys using friction stir welding and its mechanical properties

Ahn, B.-W., Choi, D.-H., Kim, J.-H., Yeon, Y.-M., Kim, D.-U., Shin, Y.-E., Jung, S.-B.
Science of Advanced Materials Vol.7 p.1535 (2015)
http://www.ingentaconnect.com/content/asp/sam/2015/00000007/00000008/art00018

06/

Hydrothermally grown in-doped zno nanorods on p-gan films for color-tunable heterojunction light-emitting-diodes

Park, G.C., Hwang, S.M., Lee, S.M., Choi, J.H., Song, K.M., Kim, H.Y., Kim, H.-S., Eum, S.-J., Jung, S.-B., Lim, J.H., Joo, J.
Scientific Reports Vol.5 p.10410 (2015)
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC4437377/

05/

Fabrication of Ag-MWNT nanocomposite paste for high-power LED package

Kim, K.-S., Park, B.-G., Kim, H., Lee, H.-S., Jung, S.-B.
Current Applied Physics Vol.15 p.S36 (2015)
http://www.sciencedirect.com/science/article/pii/S1567173915000838

04/

Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints

Yoon, J.-W., Bang, J.-H., Lee, C.-W., Jung, S.-B.
Journal of Alloys and Compounds Vol.627 p.276 (2015)
http://www.sciencedirect.com/science/article/pii/S0925838814030230

03/

Microwave sintering of silver nanoink for radio frequency applications

Kim, K.-S., Park, B.-G., Jung, K.-H., Kim, J.-W., Jeong, M.Y., Jung, S.-B.
Journal of Nanoscience and Nanotechnology Vol.15 p.2333 (2015)
http://www.ingentaconnect.com/content/asp/jnn/2015/00000015/00000003/art00059

02/

Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions

Lee, S.-M., Yoon, J.-W., Jung, S.-B.
Journal of Materials Science: Materials in Electronics Vol.26 p.1649 (2015)
http://link.springer.com/article/10.1007/s10854-014-2589-4

01/

Characteristics of Nanophase WC and WC-3 wt% (Ni, Co, and Fe) Alloys Using a Rapid Sintering Process for the Application of Friction Stir Processing Tools

Kim, D., Choi, Y., Kim, Y., Jung, S.
Application of Friction Stir Processing Tools
Advances in Materials Science and Engineering Vol.2015 p.343619 (2015)
https://www.hindawi.com/journals/amse/2015/343619/

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